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VQFN-CLIP (RWJ)
Integrated Circuits (ICs)

CSD95480RWJT

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Texas Instruments

70A SYNCHRONOUS BUCK NEXFET™ SMART POWER STAGE IN AN INDUSTRY STANDARD FOOTPRINT

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VQFN-CLIP (RWJ)
Integrated Circuits (ICs)

CSD95480RWJT

Active
Texas Instruments

70A SYNCHRONOUS BUCK NEXFET™ SMART POWER STAGE IN AN INDUSTRY STANDARD FOOTPRINT

Technical Specifications

Parameters and characteristics for this part

SpecificationCSD95480RWJT
ApplicationsSynchronous Buck Converters
Current - Output / Channel [custom]70 A
Fault ProtectionShoot-Through
FeaturesBootstrap Circuit
InterfacePWM
Load TypeCapacitive, Inductive
Mounting TypeSurface Mount
Operating Temperature [Max]125 ¯C
Operating Temperature [Min]-40 °C
Package / Case41-PowerTFQFN
Supplier Device Package41-VQFN-CLIP
TechnologyPower MOSFET
Voltage - Load [Max]16 V
Voltage - Load [Min]4.5 V
Voltage - Supply [Max]5.5 V
Voltage - Supply [Min]4.5 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyCut Tape (CT) 1$ 6.53
10$ 5.48
100$ 4.44
Digi-Reel® 1$ 6.53
10$ 5.48
100$ 4.44
Tape & Reel (TR) 250$ 3.28
500$ 3.06
750$ 3.05
Texas InstrumentsSMALL T&R 1$ 5.05
100$ 4.12
250$ 3.24
1000$ 2.75

Description

General part information

CSD95480RWJ Series

The CSD95480RWJ NexFET™ power stage is a highly optimized design for use in a high-power, high-density synchronous buck converter. This product integrates the driver IC and power MOSFETs to complete the power stage switching function. This combination produces high-current, high-efficiency, and high-speed switching capability in a small 5-mm × 6-mm outline package. It also integrates the accurate current sensing and temperature sensing functionality to simplify system design and improve accuracy. In addition, the PCB footprint has been optimized to help reduce design time and simplify the completion of the overall system design.

The CSD95480RWJ NexFET™ power stage is a highly optimized design for use in a high-power, high-density synchronous buck converter. This product integrates the driver IC and power MOSFETs to complete the power stage switching function. This combination produces high-current, high-efficiency, and high-speed switching capability in a small 5-mm × 6-mm outline package. It also integrates the accurate current sensing and temperature sensing functionality to simplify system design and improve accuracy. In addition, the PCB footprint has been optimized to help reduce design time and simplify the completion of the overall system design.