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Discrete Semiconductor Products

2SAR542PFRAT100

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Rohm Semiconductor

TRANS GP BJT PNP 30V 5A 2000MW 4-PIN(3+TAB) MPT T/R AUTOMOTIVE AEC-Q101

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Product schematic image
Discrete Semiconductor Products

2SAR542PFRAT100

Active
Rohm Semiconductor

TRANS GP BJT PNP 30V 5A 2000MW 4-PIN(3+TAB) MPT T/R AUTOMOTIVE AEC-Q101

Technical Specifications

Parameters and characteristics for this part

Specification2SAR542PFRAT100
Current - Collector (Ic) (Max) [Max]5 A
Current - Collector Cutoff (Max) [Max]1 µA
DC Current Gain (hFE) (Min) @ Ic, Vce200
Frequency - Transition240 MHz
GradeAutomotive
Mounting TypeSurface Mount
Operating Temperature150 °C
Package / CaseTO-243AA
Power - Max [Max]500 mW
QualificationAEC-Q101
Supplier Device PackageMPT3
Transistor TypePNP
Vce Saturation (Max) @ Ib, Ic400 mV
Voltage - Collector Emitter Breakdown (Max) [Max]30 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyCut Tape (CT) 1$ 0.99
10$ 0.62
100$ 0.40
500$ 0.31
Digi-Reel® 1$ 0.99
10$ 0.62
100$ 0.40
500$ 0.31
N/A 1981$ 0.98
Tape & Reel (TR) 1000$ 0.28
2000$ 0.26
3000$ 0.24
5000$ 0.23
7000$ 0.22
10000$ 0.21
25000$ 0.20
NewarkEach (Supplied on Cut Tape) 1$ 0.97
10$ 0.62
25$ 0.55
50$ 0.48
100$ 0.41
250$ 0.36
500$ 0.32
1000$ 0.29

Description

General part information

2SAR542 Series

Various products are available in lineup developed focusing on energy-saving and high reliability as main concepts, covering from ultra-compact packages to power-packages to meet the needs in market.

Documents

Technical documentation and resources

Anti-Whisker formation - Transistors

Package Information

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

Two-Resistor Model for Thermal Simulation

Thermal Design

What Is Thermal Design

Thermal Design

Package Dimensions

Package Information

2SAR542PFRA ESD Data

Characteristics Data

Condition of Soldering / Land Pattern Reference

Package Information

Notes for Temperature Measurement Using Forward Voltage of PN Junction

Thermal Design

Taping Information

Package Information

2SAR542PFRA Data Sheet

Data Sheet

2SAR542P Thermal Resistance

Characteristics Data

How to Create Symbols for PSpice Models

Models

How to Use LTspice® Models

Schematic Design & Verification

PCB Layout Thermal Design Guide

Thermal Design

Method for Monitoring Switching Waveform

Schematic Design & Verification

Compliance of the RoHS directive

Environmental Data

Report of SVHC under REACH Regulation

Environmental Data

What is a Thermal Model? (Transistor)

Thermal Design

Inner Structure

Package Information

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

Notes for Calculating Power Consumption:Static Operation

Thermal Design

Explanation for Marking

Package Information

About Export Regulations

Export Information

List of Transistor Package Thermal Resistance

Thermal Design

Notes for Temperature Measurement Using Thermocouples

Thermal Design

How to Use LTspice® Models: Tips for Improving Convergence

Schematic Design & Verification

Moisture Sensitivity Level - Transistors

Package Information

Calculation of Power Dissipation in Switching Circuit

Schematic Design & Verification

About Flammability of Materials

Environmental Data

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

Temperature derating method for Safe Operating Area (SOA)

Schematic Design & Verification

Types and Features of Transistors

Application Note

Basics of Thermal Resistance and Heat Dissipation

Thermal Design

Part Explanation

Application Note

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

Precautions When Measuring the Rear of the Package with a Thermocouple

Thermal Design

Reliability Test Result

Manufacturing Data

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

Technical Data Sheet EN

Datasheet

AEC-Q101 Automotive Requirements

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