Specification	PMEG100V060ELPDAZ

Capacitance @ Vr, F	200 pF
Current - Average Rectified (Io)	6 A
Current - Reverse Leakage @ Vr	450 nA
Grade	Automotive
Mounting Type	Surface Mount
Operating Temperature - Junction [Max]	175 ░C
Package / Case	TO-277, 3-PowerDFN
Qualification	AEC-Q101
Reverse Recovery Time (trr)	8 ns
Speed	500 ns, 200 mA
Supplier Device Package	CFP15
Technology	Schottky
Voltage - DC Reverse (Vr) (Max) [Max]	100 V
Voltage - Forward (Vf) (Max) @ If	840 mV

PMEG100 Series

100 V, 8 A low leakage current Trench MEGA Schottky barrier rectifier

Part	Current - Reverse Leakage @ Vr	Grade	Current - Average Rectified (Io)	Voltage - DC Reverse (Vr) (Max) [Max]	Capacitance @ Vr, F	Qualification	Mounting Type	Supplier Device Package	Reverse Recovery Time (trr)	Operating Temperature - Junction [Max]	Package / Case	Technology	Speed	Voltage - Forward (Vf) (Max) @ If [Max]	Voltage - Forward (Vf) (Max) @ If	Operating Temperature - Junction
Nexperia USA Inc. PMEG100V080ELPDZ	500 nA	Automotive	8 A	100 V	110 pF	AEC-Q101	Surface Mount	CFP15	10 ns	175 ░C	TO-277 3-PowerDFN	Schottky	200 mA 500 ns	850 mV
Nexperia USA Inc. PMEG100V100ELPDZ	1 µA	Automotive	10 A	100 V	135 pF	AEC-Q101	Surface Mount	CFP15	14 ns	175 ░C	TO-277 3-PowerDFN	Schottky	200 mA 500 ns	850 mV
Nexperia USA Inc. PMEG100T050ELPEZ	2.5 µA		5 A	100 V	410 pF		Surface Mount	CFP15B			TO-277 3-PowerDFN	Schottky	200 mA 500 ns		810 mV	175 °C
Nexperia USA Inc. PMEG100T030ELPEZ	2.5 µA		3 A	100 V	410 pF		Surface Mount	CFP15B			TO-277 3-PowerDFN	Schottky	200 mA 500 ns		710 mV	175 °C
Nexperia USA Inc. PMEG100V060ELPDZ	450 nA	Automotive	6 A	100 V	200 pF	AEC-Q101	Surface Mount	CFP15	8 ns	175 ░C	TO-277 3-PowerDFN	Schottky	200 mA 500 ns		840 mV
Nexperia USA Inc. PMEG100T100ELPEZ	5 µA		10 A	100 V	850 pF		Surface Mount	CFP15B	22 ns		TO-277 3-PowerDFN	Schottky	200 mA 500 ns		810 mV	175 °C
Nexperia USA Inc. PMEG100T150ELPEZ	8 µA		15 A	100 V	1340 pF		Surface Mount	CFP15B	34 ns		TO-277 3-PowerDFN	Schottky	200 mA 500 ns	740 mV		175 °C
Nexperia USA Inc. PMEG100T120ELPEZ	6 µA		12 A	100 V	1050 pF		Surface Mount	CFP15B	28 ns		TO-277 3-PowerDFN	Schottky	200 mA 500 ns		840 mV	175 °C
Nexperia USA Inc. PMEG100T080ELPEZ	4 µA		8 A	100 V	680 pF		Surface Mount	CFP15B	19 ns		TO-277 3-PowerDFN	Schottky	200 mA 500 ns	810 mV		175 °C
Nexperia USA Inc. PMEG100V060ELPDAZ	450 nA	Automotive	6 A	100 V	200 pF	AEC-Q101	Surface Mount	CFP15	8 ns	175 ░C	TO-277 3-PowerDFN	Schottky	200 mA 500 ns		840 mV

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	Cut Tape (CT)	1	$ 0.95
		10	$ 0.59
		100	$ 0.38
		500	$ 0.30
		1000	$ 0.27
		2000	$ 0.24
	Digi-Reel®	1	$ 0.95
		10	$ 0.59
		100	$ 0.38
		500	$ 0.30
		1000	$ 0.27
		2000	$ 0.24
	N/A	10559	$ 1.21
	Tape & Reel (TR)	5000	$ 0.15

Description

General part information

PMEG100 Series

Trench Schottky barrier rectifier encapsulated in a CFP15B (SOT1289B) power and flat lead Surface-Mounted Device (SMD) plastic package.

Documents

Technical documentation and resources

plastic, thermal enhanced ultra thin SMD package; 3 terminals; 2.13 mm pitch; 5.8 x 4.3 x 0.78 mm body

Marcom graphics

plastic, thermal enhanced ultra thin SMD package; 3 terminals; 5.8 x 4.3 x 0.78 mm body

Package information

Evaluation of junction temperature and thermal stacks using the virtual junction

Technical note

Questions about package outline drawings

Application note

Reflow soldering profile

Reflow soldering

PMEG100V060ELPDAZ

Deep-Dive with AI

PMEG100V060ELPDAZ

Deep-Dive with AI

Technical Specifications

PMEG100 Series

Pricing

Description

PMEG100 Series

Documents

CFP封装的肖特基整流器

Schottky rectifiers in CFP packages

CFP15; Reel pack for SMD, 13"; Q4/T2 product orientation

100 V, 6 A low leakage current Schottky barrier rectifier

Wave soldering guidelines for flatpack packages

Wave soldering profile

PMEG100V060ELPD Nexperia Product Reliability

Nexperia package poster

CFP15; Reel pack for SMD, 7"; Q4/T2 product orientation

plastic, thermal enhanced ultra thin SMD package; 3 terminals; 2.13 mm pitch; 5.8 x 4.3 x 0.78 mm body

plastic, thermal enhanced ultra thin SMD package; 3 terminals; 5.8 x 4.3 x 0.78 mm body

Evaluation of junction temperature and thermal stacks using the virtual junction

Questions about package outline drawings

Reflow soldering profile

PMEG100 Series