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Discrete Semiconductor Products

RGTV60TS65GC13

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Rohm Semiconductor

2ΜS SHORT-CIRCUIT TOLERANCE, 650V 30A, TO-247N, FIELD STOP TRENCH IGBT

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Product dimension image
Discrete Semiconductor Products

RGTV60TS65GC13

Active
Rohm Semiconductor

2ΜS SHORT-CIRCUIT TOLERANCE, 650V 30A, TO-247N, FIELD STOP TRENCH IGBT

Technical Specifications

Parameters and characteristics for this part

SpecificationRGTV60TS65GC13
Current - Collector (Ic) (Max) [Max]60 A
Current - Collector Pulsed (Icm)120 A
Gate Charge64 nC
IGBT TypeTrench Field Stop
Mounting TypeThrough Hole
Operating Temperature [Max]175 °C
Operating Temperature [Min]-40 C
Package / CaseTO-247-3
Power - Max [Max]194 W
Supplier Device PackageTO-247GE
Switching Energy500 µJ, 570 µJ
Td (on/off) @ 25°C33 ns, 105 ns
Test Condition15 V, 400 V, 30 A, 10 Ohm
Vce(on) (Max) @ Vge, Ic1.9 V
Voltage - Collector Emitter Breakdown (Max)650 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyTube 1$ 4.50
10$ 4.04
25$ 3.82
120$ 3.31
360$ 3.14
600$ 2.82
1080$ 2.38
2520$ 2.26
NewarkEach 1$ 4.90
10$ 3.93
25$ 3.68
50$ 3.43
100$ 3.18

Description

General part information

RGTV60TS65 Series

RGTV60TS65 is a IGBT with low collector - emitter saturation voltage, suitable for PFC, Solar Inverter, UPS, Welding, IH applications.

Documents

Technical documentation and resources

Two-Resistor Model for Thermal Simulation

Thermal Design

RGTV60TS65 Data Sheet

Data Sheet

What Is Thermal Design

Thermal Design

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

Moisture Sensitivity Level

Package Information

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

θ<sub>JA</sub> and Ψ<sub>JT</sub>

Thermal Design

Judgment Criteria of Thermal Evaluation

Thermal Design

Anti-Whisker formation

Package Information

How to Create Symbols for PSpice Models

Models

Types and Features of Transistors

Application Note

The Problem with Traditional Vaccine Storage Freezers and How ROHM Cutting-edge Power Solutions Can Take them to the Next Level

White Paper

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

Example of Heat Dissipation Design for TO Packages: Effect of Heat Dissipation Materials

Thermal Design

Method for Monitoring Switching Waveform

Schematic Design & Verification

About Export Administration Regulations (EAR)

Export Information

Generation Mechanism of Voltage Surge on Commutation Side (Basic)

Technical Article

Precautions for Thermal Resistance of Insulation Sheet

Thermal Design

Power Eco Family: Overview of ROHM's Power Semiconductor Lineup

White Paper

Notes for Temperature Measurement Using Thermocouples

Thermal Design

Semikron Danfoss: Partnering for the Safe Supply of Industrial Power Modules

White Paper

Compliance of the ELV directive

Environmental Data

New Gen 3 650V IGBT - A Soft And Efficient Switch For Industrial Applications

Application Note

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

How to Use the Thermal Resistance and Thermal Characteristics Parameters

Thermal Design

About Flammability of Materials

Environmental Data

4 Steps for Successful Thermal Designing of Power Devices

White Paper

How to Use LTspice&reg; Models: Tips for Improving Convergence

Schematic Design & Verification

PCB Layout Thermal Design Guide

Thermal Design