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TO-220-2 (TO-220NFM)
Discrete Semiconductor Products

RFN20TJ6SFHGC9

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Rohm Semiconductor

SUPER FAST RECOVERY DIODE (AEC-Q101 QUALIFIED)

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TO-220-2 (TO-220NFM)
Discrete Semiconductor Products

RFN20TJ6SFHGC9

Active
Rohm Semiconductor

SUPER FAST RECOVERY DIODE (AEC-Q101 QUALIFIED)

Technical Specifications

Parameters and characteristics for this part

SpecificationRFN20TJ6SFHGC9
Current - Reverse Leakage @ Vr10 µA
GradeAutomotive
Mounting TypeThrough Hole
Operating Temperature - Junction150 ¯C
Package / CaseTO-220-2 Full Pack
QualificationAEC-Q101
Reverse Recovery Time (trr)140 ns
Speed500 ns, 200 mA
Supplier Device PackageTO-220ACFP
TechnologyStandard
Voltage - DC Reverse (Vr) (Max) [Max]600 V
Voltage - Forward (Vf) (Max) @ If [Max]1.55 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyN/A 978$ 3.06
Tube 1$ 2.55
50$ 1.29
100$ 1.18

Description

General part information

RFN20 Series

ROHM's fast recovery diodes are ultra high-speed, low VF, and suited for significant efficiency increase of switching power supply as well as reduction of switching loss.

Documents

Technical documentation and resources

PCB Layout Thermal Design Guide

Thermal Design

What is a Thermal Model? (Diode)

Thermal Design

Taping Information

Package Information

How to Select Reverse Current Protection Diodes for LDO Regulators

Schematic Design & Verification

RFN20TJ6SFHG Data Sheet

Data Sheet

About Flammability of Materials

Environmental Data

θ<sub>JA</sub> and Ψ<sub>JT</sub>

Thermal Design

Example of Heat Dissipation Design for TO Packages: Effect of Heat Dissipation Materials

Thermal Design

List of Diode Package Thermal Resistance

Thermal Design

What Is Thermal Design

Thermal Design

Judgment Criteria of Thermal Evaluation

Thermal Design

Diode Types and Applications

Technical Article

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

About Export Regulations

Export Information

How to Select Rectifier Diodes

Technical Article

Precautions When Measuring the Rear of the Package with a Thermocouple

Thermal Design

Part Explanation

Application Note

θ<sub>JC</sub> and Ψ<sub>JT</sub>

Thermal Design

Two-Resistor Model for Thermal Simulation

Thermal Design

Notes for Temperature Measurement Using Thermocouples

Thermal Design

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

How to Use LTspice&reg; Models

Schematic Design & Verification

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

Compliance of the RoHS directive

Environmental Data

Inner Structure

Package Information

Method for Monitoring Switching Waveform

Schematic Design & Verification

How to Use the Thermal Resistance and Thermal Characteristics Parameters

Thermal Design

Package Dimensions

Package Information

Reliability Test Result

Manufacturing Data

Absolute Maximum Rating and Electrical Characteristics of Diodes

Technical Article

RFN20TJ6SFHG ESD Data

Characteristics Data

Condition of Soldering / Land Pattern Reference

Package Information

Notes for Calculating Power Consumption:Static Operation

Thermal Design

Power Loss and Thermal Design of Diodes

Thermal Design

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

Certificate of not containing SVHC under REACH Regulation

Environmental Data

Notes for Temperature Measurement Using Forward Voltage of PN Junction

Thermal Design

Moisture Sensitivity Level - Diodes

Package Information

Anti-Whisker formation - Diodes

Package Information

Basics of Thermal Resistance and Heat Dissipation

Thermal Design

How to Use LTspice&reg; Models: Tips for Improving Convergence

Schematic Design & Verification