Specification	MSP430F5327IPN

Connectivity	SCI, I2C, LINbus, SPI, UART/USART, IrDA
Core Processor	MSP430 CPUXV2
Core Size	16-Bit
Data Converters [custom]	16
Data Converters [custom]	12 b
Mounting Type	Surface Mount
Number of I/O	63 I/O
Operating Temperature [Max]	85 °C
Operating Temperature [Min]	-40 °C
Oscillator Type	Internal
Package / Case	80-LQFP
Peripherals	Brown-out Detect/Reset, DMA, POR, WDT, PWM
Program Memory Size	96 KB
Program Memory Type	FLASH
RAM Size	8 K
Speed	25 MHz
Voltage - Supply (Vcc/Vdd) [Max]	3.6 V
Voltage - Supply (Vcc/Vdd) [Min]	1.8 V

MSP430F5327 Series

25 MHz MCU with 96KB Flash, 8KB SRAM, 12-bit ADC, comparator, DMA, UART/SPI/I2C, HW multiplier

Part	Peripherals	Mounting Type	RAM Size	Speed	Core Size	Program Memory Type	Package / Case	Data Converters [custom]	Data Converters [custom]	Program Memory Size	Number of I/O	Voltage - Supply (Vcc/Vdd) [Min]	Voltage - Supply (Vcc/Vdd) [Max]	Operating Temperature [Max]	Operating Temperature [Min]	Core Processor	Oscillator Type	Connectivity
Texas Instruments MSP430F5327IPN	Brown-out Detect/Reset DMA POR PWM WDT	Surface Mount	8 K	25 MHz	16-Bit	FLASH	80-LQFP	16	12 b	96 KB	63 I/O	1.8 V	3.6 V	85 °C	-40 °C	MSP430 CPUXV2	Internal	I2C IrDA LINbus SCI SPI UART/USART
Texas Instruments MSP430F5327IPNR	Brown-out Detect/Reset DMA POR PWM WDT	Surface Mount	8 K	25 MHz	16-Bit	FLASH	80-LQFP	16	12 b	96 KB	63 I/O	1.8 V	3.6 V	85 °C	-40 °C	MSP430 CPUXV2	Internal	I2C IrDA LINbus SCI SPI UART/USART

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	Tray	1	$ 8.00
		10	$ 7.22
		25	$ 6.89
		119	$ 5.98
		238	$ 5.71
		476	$ 5.21
		952	$ 4.54
Texas Instruments	JEDEC TRAY (10+1)	1	$ 6.12
		100	$ 4.99
		250	$ 3.92
		1000	$ 3.33

Description

General part information

MSP430F5327 Series

The TI MSP430™ family of ultra-low-power microcontrollers consists of several devices featuring different sets of peripherals targeted for various applications. The architecture, combined with extensive low-power modes is optimized to achieve extended battery life in portable measurement applications. The device features a powerful 16-bit RISC CPU, 16-bit registers, and constant generators that contribute to maximum code efficiency. The digitally controlled oscillator (DCO) allows the devices to wake up from low-power modes to active mode in 3.5 µs (typical).

The MSP430F5329, MSP430F5327, and MSP430F5325 are microcontroller configurations with an integrated 3.3-V LDO, four 16-bit timers, a high-performance 12-bit ADC, two USCIs, a hardware multiplier, DMA, an RTC module with alarm capabilities, and 63 I/O pins.

The MSP430F5328, MSP430F5326, and MSP430F5324 include all of these peripherals but have 47 I/O pins.

Documents

Technical documentation and resources

MSP430F5327IPN

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MSP430F5327IPN

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Technical Specifications

MSP430F5327 Series

Pricing

Description

MSP430F5327 Series

Documents

Migration Guide From MSP430 MCUs to MSPM0 MCUs (Rev. A)

MSP430 32-kHz Crystal Oscillators (Rev. D)

Powering the MSP430 from a High Voltage Input using the TPS62122 (Rev. C)

MSP430x5xx and MSP430x6xx Family User's Guide (Rev. Q)

Wave Digital Filtering Using an MSP430 MCU (Rev. A)

Software Coding Techniques for MSP430™ MCUs (Rev. B)

SYS/BIOS (TI-RTOS Kernel) User's Guide (Rev. V)

MSP430F532x Mixed-Signal Microcontrollers datasheet (Rev. G)

Design Considerations When Using the MSP430 Graphics Library

Li-Ion Battery Charger Solution Using an MSP430™ MCU (Rev. B)

Efficient Multiplication and Division Using MSP430 MCUs (Rev. A)

Using the MSP430 Timer_D Module in Hi-Resolution Mode

MSP430 MCUs Development Guide Book (Rev. A)

Safety Manual for MSP430G2xx, F5xx, and FR57xx in IEC 60730 Safety Applications (Rev. A)

MSP430 System ESD Troubleshooting Guide

MSP430F5xx Overview and Comparison to MSP430F2xx and MSP430F4xx (Rev. A)

Power Management Solutions for Ultra-Low-Power 16-Bit MSP430 MCUs (Rev. D)

ESD Diode Current Specification (Rev. B)

Random Number Generation Using MSP430™ MCUs (Rev. A)

Using the TPS3619 With MSP430 Microcontrollers (Rev. B)

CRC Implementation with MSP430 MCUs (Rev. A)

Programming a Flash-Based MSP430 MCU Using the JTAG Interface (Rev. H)

MSP430 System-Level ESD Considerations (Rev. B)

Implementing An Ultra-Low-Power Keypad Interface With MSP430 MCUs (Rev. A)

MSP430 LFXT1 Oscillator Accuracy (Rev. A)

Mixing C and Assembler With MSP430™ MCUs (Rev. A)

Tiny DCDC Converter Reference Design (Rev. A)

Understanding MSP430 Flash Data Retention (Rev. A)

MSP430 Flash Memory Characteristics (Rev. B)

1.8V – 5.5V Input, High-Efficiency DCDC Converter Reference Design for MSP430 (Rev. B)

MSP Code Protection Features

Capacitive Touch and MSP Microcontrollers (Rev. A)

Industrial Communications Solutions Featuring MSP Microcontrollers

Advanced Debugging Using the Enhanced Emulation Module (EEM) With CCS v6 (Rev. F)

Interfacing the 3-V MSP430 MCU to 5-V Circuits (Rev. A)

Migrating from the MSP430F5xx,F6xx Family to the MSP430FR58xx/FR59xx/68xx Family (Rev. D)

MSP430F5327 Device Erratasheet (Rev. AB)

General Oversampling of MSP ADCs for Higher Resolution (Rev. A)

MSP430F5327 Series