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RD3H045SPTL1
Discrete Semiconductor Products

RD3H045SPTL1

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Rohm Semiconductor

PCH -45V -4.5A, TO-252 (DPAK), POWER MOSFET

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RD3H045SPTL1
Discrete Semiconductor Products

RD3H045SPTL1

Active
Rohm Semiconductor

PCH -45V -4.5A, TO-252 (DPAK), POWER MOSFET

Technical Specifications

Parameters and characteristics for this part

SpecificationRD3H045SPTL1
Current - Continuous Drain (Id) @ 25°C4.5 A
Drain to Source Voltage (Vdss)45 V
Drive Voltage (Max Rds On, Min Rds On) [Max]4 V
Drive Voltage (Max Rds On, Min Rds On) [Min]10 V
FET TypeP-Channel
Gate Charge (Qg) (Max) @ Vgs [Max]12 nC
Input Capacitance (Ciss) (Max) @ Vds550 pF
Mounting TypeSurface Mount
Operating Temperature [Max]150 °C
Operating Temperature [Min]-55 °C
Package / CaseTO-252-3, SC-63, DPAK (2 Leads + Tab)
Power Dissipation (Max)15 W
Supplier Device PackageTO-252
TechnologyMOSFET (Metal Oxide)
Vgs (Max)20 V
Vgs(th) (Max) @ Id3 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyN/A 3832$ 1.35
NewarkEach (Supplied on Cut Tape) 1$ 1.54
10$ 1.03
25$ 0.93
50$ 0.83
100$ 0.74
250$ 0.67
500$ 0.59
1000$ 0.52

Description

General part information

RD3H045SP Series

RD3H045SP is a power MOSFET with low on - resistance, suitable for switching.

Documents

Technical documentation and resources

Package Dimensions

Package Information

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

Reliability Test Result

Manufacturing Data

Part Explanation

Application Note

How to Create Symbols for PSpice Models

Models

Notes for Temperature Measurement Using Thermocouples

Thermal Design

Explanation for Marking

Package Information

Two-Resistor Model for Thermal Simulation

Thermal Design

Precautions When Measuring the Rear of the Package with a Thermocouple

Thermal Design

About Flammability of Materials

Environmental Data

Basics of Thermal Resistance and Heat Dissipation

Thermal Design

Temperature derating method for Safe Operating Area (SOA)

Schematic Design & Verification

PCB Layout Thermal Design Guide

Thermal Design

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

Anti-Whisker formation - Transistors

Package Information

MOSFET Gate Drive Current Setting for Motor Driving

Technical Article

TO-252_TL1 Taping Information

Package Information

Method for Monitoring Switching Waveform

Schematic Design & Verification

What Is Thermal Design

Thermal Design

Compliance of the RoHS directive

Environmental Data

How to Use LTspice® Models: Tips for Improving Convergence

Schematic Design & Verification

P-channel Power MOSFETs selection guide

Technical Article

Moisture Sensitivity Level - Transistors

Package Information

Calculation of Power Dissipation in Switching Circuit

Schematic Design & Verification

Notes for Calculating Power Consumption:Static Operation

Thermal Design

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

RD3H045SP ESD Data

Characteristics Data

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

About Export Regulations

Export Information

How to Use LTspice® Models

Schematic Design & Verification

Condition of Soldering / Land Pattern Reference

Package Information

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

MOSFET Gate Resistor Setting for Motor Driving

Technical Article

RD3H045SP Data Sheet

Data Sheet

Types and Features of Transistors

Application Note

Report of SVHC under REACH Regulation

Environmental Data

List of Transistor Package Thermal Resistance

Thermal Design

What is a Thermal Model? (Transistor)

Thermal Design

Example of Heat Dissipation Design for TO Packages: Effect of Heat Dissipation Materials

Thermal Design

Notes for Temperature Measurement Using Forward Voltage of PN Junction

Thermal Design

Technical Data Sheet EN

Datasheet