Specification	LPC18S30FBD144E

Connectivity	Ethernet, IrDA, EBI/EMI, SPI, I2C, SSP, QEI, UART/USART, Microwire, MMC/SD, SSI, CANbus, USB
Core Processor	ARM® Cortex®-M3
Core Size	32-Bit Single-Core
Data Converters [custom]	1, 8
Data Converters [custom]	10, 10
Mounting Type	Surface Mount
Number of I/O	83
Operating Temperature [Max]	85 °C
Operating Temperature [Min]	-40 °C
Oscillator Type	Internal
Package / Case	144-LQFP
Peripherals	Brown-out Detect/Reset, DMA, POR, WDT, PWM, I2S
Program Memory Type	ROMless
RAM Size	200 K
Speed	180 MHz
Supplier Device Package	144-LQFP (20x20)
Voltage - Supply (Vcc/Vdd) [Max]	3.6 V
Voltage - Supply (Vcc/Vdd) [Min]	2.2 V

LPC18S30 Series

Part	Speed	Peripherals	Connectivity	Voltage - Supply (Vcc/Vdd) [Min]	Voltage - Supply (Vcc/Vdd) [Max]	Package / Case	Core Size	Core Processor	Supplier Device Package	Program Memory Type	Number of I/O	RAM Size	Data Converters [custom]	Data Converters [custom]	Operating Temperature [Max]	Operating Temperature [Min]	Oscillator Type	Mounting Type
Freescale Semiconductor - NXP LPC18S30FET256E	180 MHz	Brown-out Detect/Reset DMA I2S POR PWM WDT	CANbus EBI/EMI Ethernet I2C IrDA Microwire MMC/SD QEI SPI SSI SSP UART/USART USB	2.2 V	3.6 V	256-LBGA	32-Bit Single-Core	ARM® Cortex®-M3	256-LBGA (17x17)	ROMless	164 I/O	200 K	1 8	10 10	85 °C	-40 °C	Internal	Surface Mount
Freescale Semiconductor - NXP LPC18S30FBD144E	180 MHz	Brown-out Detect/Reset DMA I2S POR PWM WDT	CANbus EBI/EMI Ethernet I2C IrDA Microwire MMC/SD QEI SPI SSI SSP UART/USART USB	2.2 V	3.6 V	144-LQFP	32-Bit Single-Core	ARM® Cortex®-M3	144-LQFP (20x20)	ROMless	83	200 K	1 8	10 10	85 °C	-40 °C	Internal	Surface Mount

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

General part information

ARM® Cortex®-M3 LPC18xx Microcontroller IC 32-Bit Single-Core 180MHz ROMless 144-LQFP (20x20)

Technical documentation and resources