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8-DFN 3x3
Integrated Circuits (ICs)

NCS2211MNTXG

Active
ON Semiconductor

AUDIO POWER AMPLIFIER, CLASS AB, BTL, 1 CHANNEL, 1.5 W X 1 @ 4OHM, 2.7 V TO 5.5 V, 8 PINS, DFN

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8-DFN 3x3
Integrated Circuits (ICs)

NCS2211MNTXG

Active
ON Semiconductor

AUDIO POWER AMPLIFIER, CLASS AB, BTL, 1 CHANNEL, 1.5 W X 1 @ 4OHM, 2.7 V TO 5.5 V, 8 PINS, DFN

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Technical Specifications

Parameters and characteristics for this part

SpecificationNCS2211MNTXG
FeaturesShutdown
Max Output Power x Channels @ Load1.5 W, 1
Mounting TypeSurface Mount
Operating Temperature [Max]85 °C
Operating Temperature [Min]-40 °C
Output Type1-Channel (Mono)
Package / Case8-VFDFN Exposed Pad
Supplier Device Package8-DFN (3x3)
TypeClass AB
Voltage - Supply [Max]5.5 V
Voltage - Supply [Min]2.7 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
ArrowN/A 1$ 0.31
10$ 0.31
25$ 0.30
100$ 0.29
250$ 0.29
500$ 0.28
1000$ 0.28
DigikeyCut Tape (CT) 1$ 1.52
10$ 0.92
25$ 0.77
100$ 0.61
250$ 0.53
500$ 0.48
1000$ 0.44
Digi-Reel® 1$ 1.52
10$ 0.92
25$ 0.77
100$ 0.61
250$ 0.53
500$ 0.48
1000$ 0.44
Tape & Reel (TR) 3000$ 0.40
6000$ 0.37
9000$ 0.36
15000$ 0.35
NewarkEach (Supplied on Full Reel) 3000$ 0.47
6000$ 0.43
12000$ 0.40
18000$ 0.38
30000$ 0.36
ON SemiconductorN/A 1$ 0.37

Description

General part information

NCS2211 Series

The NCS2211 is a high performance, low distortion Class A/B audio amplifier. It is capable of delivering 1W of output power into an 8 Ω speaker bridge-tied load (BTL). The NCS2211 will operate over a wide temperature range, and it is specified for single-supply voltage operation for portable applications.It features low distortion performance, 0.2% typical THD + N at 1.0 W and incorporates a shutdown/enable feature to extend battery life. The shutdown/enable feature will reduce the quiescent current to 1 µ A maximum.The NCS2211 is designed to operate over the -40°C to +85°C temperature range, and is available in an 8-lead SOIC package and a 3x3 mm DFN8 package. The SOIC package is pin compatible with equivalent function and comparable performance to competitive devices as is the DFN8 package. The DFN8 has a low thermal resistance of only 70°C/W plus has an exposed metal pad to facilitate heat conduction to copper PCB material.Low distortion, high power, low quiescent current, and small packaging makes the NCS2211 suitable for applications including notebook and desktop computers, PDA's, and speaker phones.

Documents

Technical documentation and resources