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Discrete Semiconductor Products

RF1601T2DNZC9

Active
Rohm Semiconductor

RECTIFIER, 200V, 16A, TO-220FN ROHS COMPLIANT: YES

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Product thumbnail image
Discrete Semiconductor Products

RF1601T2DNZC9

Active
Rohm Semiconductor

RECTIFIER, 200V, 16A, TO-220FN ROHS COMPLIANT: YES

Technical Specifications

Parameters and characteristics for this part

SpecificationRF1601T2DNZC9
Current - Average Rectified (Io) (per Diode)16 A
Current - Reverse Leakage @ Vr10 ÁA
Diode Configuration1 Pair Common Cathode
Mounting TypeThrough Hole
Operating Temperature - Junction150 ¯C
Package / CaseTO-220-3 Full Pack
Reverse Recovery Time (trr)30 ns
Speed500 ns, 200 mA
Supplier Device PackageTO-220FN
TechnologyStandard
Voltage - DC Reverse (Vr) (Max) [Max]200 V
Voltage - Forward (Vf) (Max) @ If930 mV

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyN/A 966$ 2.48
Tube 1$ 1.76
50$ 0.86
100$ 0.77
500$ 0.71
NewarkEach 1$ 2.58
10$ 1.86
100$ 1.13
500$ 0.91
1000$ 0.81
3000$ 0.78
5000$ 0.73

Description

General part information

RF1601 Series

RF1601T2DNZ is Super Fast Recovery Diode for general rectification.

Documents

Technical documentation and resources

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

Taping Information

Package Information

Two-Resistor Model for Thermal Simulation

Thermal Design

RF1601T2DNZ Data Sheet

Data Sheet

Absolute Maximum Rating and Electrical Characteristics of Diodes

Technical Article

Diode Types and Applications

Technical Article

About Export Regulations

Export Information

Compliance of the RoHS directive

Environmental Data

Inner Structure

Package Information

Reliability Test Result

Manufacturing Data

Explanation for Marking

Package Information

What is a Thermal Model? (Diode)

Thermal Design

Notes for Temperature Measurement Using Forward Voltage of PN Junction

Thermal Design

How to Select Reverse Current Protection Diodes for LDO Regulators

Schematic Design & Verification

How to Use LTspice® Models: Tips for Improving Convergence

Schematic Design & Verification

Method for Monitoring Switching Waveform

Schematic Design & Verification

θ<sub>JA</sub> and Ψ<sub>JT</sub>

Thermal Design

Basics of Thermal Resistance and Heat Dissipation

Thermal Design

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

Power Loss and Thermal Design of Diodes

Thermal Design

PCB Layout Thermal Design Guide

Thermal Design

RF1601T2DNZ ESD Data

Characteristics Data

Condition of Soldering / Land Pattern Reference

Package Information

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

How to Select Rectifier Diodes

Technical Article

How to Use the Thermal Resistance and Thermal Characteristics Parameters

Thermal Design

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

Certificate of not containing SVHC under REACH Regulation

Environmental Data

List of Diode Package Thermal Resistance

Thermal Design

Judgment Criteria of Thermal Evaluation

Thermal Design

About Flammability of Materials

Environmental Data

Notes for Temperature Measurement Using Thermocouples

Thermal Design

How to Use LTspice&reg; Models

Schematic Design & Verification

Example of Heat Dissipation Design for TO Packages: Effect of Heat Dissipation Materials

Thermal Design

θ<sub>JC</sub> and Ψ<sub>JT</sub>

Thermal Design

Part Explanation

Application Note

What Is Thermal Design

Thermal Design

Anti-Whisker formation - Diodes

Package Information

Package Dimensions

Package Information

Precautions When Measuring the Rear of the Package with a Thermocouple

Thermal Design

Moisture Sensitivity Level - Diodes

Package Information

Notes for Calculating Power Consumption:Static Operation

Thermal Design