Zenode.ai Logo
Beta
Product thumbnail image
Integrated Circuits (ICs)

BD2311NVX-LBE2

Active
Rohm Semiconductor

SINGLE-CHANNEL ULTRA-FAST GATE DRIVER FOR DRIVING GAN DEVICES

Deep-Dive with AI

Search across all available documentation for this part.

Product thumbnail image
Integrated Circuits (ICs)

BD2311NVX-LBE2

Active
Rohm Semiconductor

SINGLE-CHANNEL ULTRA-FAST GATE DRIVER FOR DRIVING GAN DEVICES

Technical Specifications

Parameters and characteristics for this part

SpecificationBD2311NVX-LBE2
Channel TypeSingle
Current - Peak Output (Source, Sink) [custom]7 A
Current - Peak Output (Source, Sink) [custom]5 A
Driven ConfigurationLow-Side
Gate TypeN-Channel MOSFET, MOSFET (N-Channel)
Input TypeInverting
Logic Voltage - VIL, VIH [custom]1.7 V
Logic Voltage - VIL, VIH [custom]1.8 V
Mounting TypeSurface Mount
Number of Drivers1
Operating Temperature [Max]125 °C
Operating Temperature [Min]-40 C
Package / Case6-UDFN Exposed Pad
Rise / Fall Time (Typ) [custom]650 ps
Rise / Fall Time (Typ) [custom]700 ps
Supplier Device PackageSSON06RX2020
Voltage - Supply [Max]5.5 V
Voltage - Supply [Min]4.5 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyCut Tape (CT) 1$ 4.60
10$ 4.13
25$ 3.91
100$ 3.39
250$ 3.21
500$ 2.88
1000$ 2.43
Digi-Reel® 1$ 4.60
10$ 4.13
25$ 3.91
100$ 3.39
250$ 3.21
500$ 2.88
1000$ 2.43
N/A 3123$ 4.28
Tape & Reel (TR) 4000$ 2.31
NewarkEach (Supplied on Cut Tape) 1$ 5.65
10$ 3.39
25$ 3.19
50$ 2.98
100$ 2.79
250$ 2.49
500$ 2.31
1000$ 2.24

Description

General part information

BD2311NVX-LB Series

This product is a rank product for the industrial equipment market. This is the best product for use in these applications. BD2311NVX-LB is a single gate driver capable of driving GaN HEMTs at Ultra-Fast with narrow pulses, which can contribute to the long-range and high accuracy of LiDAR. It can supply 5.4A output current in a small 6-pin SON package. As a protection function, the driver includes an Undervoltage Lockout(UVLO) between VCC and GND.

Documents

Technical documentation and resources

How to Use the Two-Resistor Model

Thermal Design

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

θ<sub>JA</sub> and Ψ<sub>JT</sub>

Thermal Design

Thermal Resistance

Thermal Design

SSON06RX2020 Package Information

Package Information

How to Use the Thermal Resistance and Thermal Characteristics Parameters

Thermal Design

Cutting-Edge Web Simulation Tool "ROHM Solution Simulator" Capable of Complete Circuit Verification of Power Devices and Driver ICs

White Paper

Design Guide and Example of Stencil for Exposed Pad

Thermal Design

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

Heat Dissipation Effect of Thermal Via in Exposed Pad Type Package

Thermal Design

What Is Thermal Design

Thermal Design

Laser Driver Reference Design with GaN HEMT for High-Resolution LiDAR

White Paper

Solder Joint Rate and Thermal Resistance of Exposed Pad

Thermal Design

Five Steps for Successful Thermal Design of IC

White Paper

Basics of Thermal Resistance and Heat Dissipation

Thermal Design

Precautions for Thermal Resistance of Insulation Sheet

Thermal Design

ROHM's EcoGaN™ Solutions Contribute to Greater Miniaturization and Energy Savings

White Paper

BD2311NVX-LB Data Sheet

Data Sheet

Factory Information

Manufacturing Data

θ<sub>JC</sub> and Ψ<sub>JT</sub>

Thermal Design

Judgment Criteria of Thermal Evaluation

Thermal Design

PCB Layout Thermal Design Guide

Thermal Design

QUICK START GUIDE for REFLD002

Quick Start Guide