
FPF1038UCX
ActivePOWER SWITCH HI SIDE 1-OUT 2A 0.075MOHM 6-PIN WLCSP T/R
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FPF1038UCX
ActivePOWER SWITCH HI SIDE 1-OUT 2A 0.075MOHM 6-PIN WLCSP T/R
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Technical Specifications
Parameters and characteristics for this part
| Specification | FPF1038UCX |
|---|---|
| Current - Output (Max) [Max] | 3.5 A |
| Features | Slew Rate Controlled |
| Input Type | Non-Inverting |
| Interface | On/Off |
| Mounting Type | Surface Mount |
| Number of Outputs | 1 |
| Operating Temperature [Max] | 85 °C |
| Operating Temperature [Min] | -40 °C |
| Output Configuration | High Side |
| Output Type | P-Channel |
| Package / Case | 6-UFBGA, WLCSP |
| Ratio - Input:Output [custom] | 1:1 |
| Rds On (Typ) | 20 mOhm |
| Supplier Device Package | 6-WLCSP |
| Supplier Device Package [x] | 0.96 |
| Supplier Device Package [y] | 1.66 |
| Switch Type | General Purpose |
| Voltage - Supply (Vcc/Vdd) | False |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
| Distributor | Package | Quantity | $ | |
|---|---|---|---|---|
| ON Semiconductor | N/A | 1 | $ 0.25 | |
Description
General part information
FPF1038 Series
The FPF1038 advanced load management switch targets applications requiring a highly integrated solution for disconnecting loads powered from DC Power Rail (<6V) with stringent shutdown current targets and high load capacitances (up to 200 µF). The FPF1038 consists of slew-rate controlled low-impedance MOSFET switch (21 mΩ typical) and other integrated analog features. The slew-rate controlled turn-on characteristic prevents inrush-current and the resulting excessive voltage droop on power rails.This device has exceptionally low shutdown current drain (<1 µA maximum) that facilitate compliance in very low standby power applications. The input voltage range operates from 1.2 V to 5.5 V DC to fulfill a wide range of applications in consumer, optical, medical, storage, portable, and industrial device power management.Switch control is managed by a logic input (active HIGH) capable of interfacing directly with low-voltage control signal/GPIO with no external pull-up required. The device is packaged in advanced fully "green" 1 mm x 1.5 mm Wafer-Level Chip-Scale Packaging (WLCSP); providing excellent thermal conductivity, small footprint, and low electrical resistance for wider application usage.
Documents
Technical documentation and resources