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RSX201L-30TE25
Discrete Semiconductor Products

RSX201L-30TE25

NRND
Rohm Semiconductor

HIGH EFFICIENCY , HIGH RELIABILITY TYPE SCHOTTKY BARRIER DIODE

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RSX201L-30TE25
Discrete Semiconductor Products

RSX201L-30TE25

NRND
Rohm Semiconductor

HIGH EFFICIENCY , HIGH RELIABILITY TYPE SCHOTTKY BARRIER DIODE

Technical Specifications

Parameters and characteristics for this part

SpecificationRSX201L-30TE25
Current - Average Rectified (Io)2 A
Current - Reverse Leakage @ Vr150 µA
Mounting TypeSurface Mount
Operating Temperature - Junction [Max]150 °C
Package / CaseDO-214AC, SMA
Speed500 ns, 200 mA
Supplier Device PackagePMDS
TechnologySchottky
Voltage - DC Reverse (Vr) (Max) [Max]30 V
Voltage - Forward (Vf) (Max) @ If440 mV

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyN/A 0$ 0.64
MouserN/A 1500$ 0.13
9000$ 0.12
24000$ 0.11
49500$ 0.11

Description

General part information

RSX201L-30 Series

ROHM's schottky barrier diodes are low VF, low IR and high ESD resistant, suitable for PC,mobile phone and various portable electronics.

Documents

Technical documentation and resources

RSX201L-30TE25 | Datasheet

Datasheet

How to Use the Thermal Resistance and Thermal Characteristics Parameters

Thermal Design

Notes for Temperature Measurement Using Thermocouples

Thermal Design

Diode Selection Method for Asynchronous Converter

Schematic Design & Verification

Diode Types and Applications

Technical Article

How to Create Symbols for PSpice Models

Models

Moisture Sensitivity Level - Diodes

Package Information

Notes for Calculating Power Consumption:Static Operation

Thermal Design

Taping Information

Package Information

ESD Data

Characteristics Data

θ<sub>JC</sub> and Ψ<sub>JT</sub>

Thermal Design

Part Explanation

Application Note

PCB Layout Thermal Design Guide

Thermal Design

Absolute Maximum Rating and Electrical Characteristics of Diodes

Technical Article

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

How to Use LTspice&reg; Models: Tips for Improving Convergence

Schematic Design & Verification

List of Diode Package Thermal Resistance

Thermal Design

Notes for Temperature Measurement Using Forward Voltage of PN Junction

Thermal Design

What Is Thermal Design

Thermal Design

About Flammability of Materials

Environmental Data

Explanation for Marking

Package Information

Judgment Criteria of Thermal Evaluation

Thermal Design

Compliance of the RoHS directive

Environmental Data

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

RSX201L-30 Data Sheet

Data Sheet

Power Loss and Thermal Design of Diodes

Thermal Design

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

ROHM's SBD Lineup Contributes to Greater Miniaturization and Lower Loss in Automotive, Industrial, and Consumer Equipment

White Paper

What is a Thermal Model? (Diode)

Thermal Design

Basics of Thermal Resistance and Heat Dissipation

Thermal Design

Two-Resistor Model for Thermal Simulation

Thermal Design

Anti-Whisker formation - Diodes

Package Information

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

Condition of Soldering / Land Pattern Reference

Package Information

How to Use LTspice&reg; Models

Schematic Design & Verification

How to Select Reverse Current Protection Diodes for LDO Regulators

Schematic Design & Verification

About Export Regulations

Export Information

Constitution Materials List

Environmental Data

Report of SVHC under REACH Regulation

Environmental Data

How to Select Rectifier Diodes

Technical Article

Precautions When Measuring the Rear of the Package with a Thermocouple

Thermal Design

θ<sub>JA</sub> and Ψ<sub>JT</sub>

Thermal Design

Inner Structure

Package Information

Method for Monitoring Switching Waveform

Schematic Design & Verification

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

Package Dimensions

Package Information

Reliability Test Result

Manufacturing Data