Specification	NRTS6100TFSTXG

Capacitance @ Vr, F	782 pF
Current - Average Rectified (Io)	6 A
Current - Reverse Leakage @ Vr	50 µA
Mounting Type	Surface Mount
Operating Temperature - Junction [Max]	175 ░C
Operating Temperature - Junction [Min]	-55 C
Package / Case	8-PowerWDFN
Speed	200 mA, 500 ns
Supplier Device Package	8-WDFN (3.3x3.3)
Technology	Schottky
Voltage - DC Reverse (Vr) (Max) [Max]	100 V
Voltage - Forward (Vf) (Max) @ If	680 mV

NRTS6100TFS Series

NRTS6100TFS: 6 A, 100 V High Performance Trench Schottky Rectifier in u8-FL package

Part	Mounting Type	Operating Temperature - Junction [Max]	Operating Temperature - Junction [Min]	Supplier Device Package	Voltage - Forward (Vf) (Max) @ If	Speed	Voltage - DC Reverse (Vr) (Max) [Max]	Current - Average Rectified (Io)	Technology	Capacitance @ Vr, F	Current - Reverse Leakage @ Vr	Package / Case
ON Semiconductor NRTS6100TFSTBG	Surface Mount	175 ░C	-55 C	8-WDFN (3.3x3.3)	680 mV	200 mA 500 ns	100 V	6 A	Schottky	782 pF	50 µA	8-PowerWDFN
ON Semiconductor NRTS6100TFSTXG	Surface Mount	175 ░C	-55 C	8-WDFN (3.3x3.3)	680 mV	200 mA 500 ns	100 V	6 A	Schottky	782 pF	50 µA	8-PowerWDFN
ON Semiconductor NRTS6100TFSTWG	Surface Mount	175 ░C	-55 C	8-WDFN (3.3x3.3)	680 mV	200 mA 500 ns	100 V	6 A	Schottky	782 pF	50 µA	8-PowerWDFN

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	Cut Tape (CT)	1	$ 0.66
	Digi-Reel®	1	$ 0.66
	Tape & Reel (TR)	5000	$ 0.21
		10000	$ 0.20
		25000	$ 0.19
		50000	$ 0.19
Newark	Each	2500	$ 0.20
		10000	$ 0.19
ON Semiconductor	N/A	1	$ 0.20

Description

General part information

NRTS6100TFS Series

This Trench Schottky rectifier is high performance device in u8-FL package. The lower forward voltage, less leakage current, and small junction capacitance is suitable for high switching frequency high density DC to DC conversion application. Offering higher avalanche energy capability for Oring or reverse protection application. The u8-FL package provides an excellent thermal performance, less land area of board space, and low profile.