Specification	MC9S08JS16CWJ

Connectivity	LINbus, SPI, USB, SCI
Core Processor	S08
Core Size (Bit Width)	8 Bit
Mounting Type	Surface Mount
Number of I/O	14
Operating Temperature (Max)	85 °C
Operating Temperature (Min)	-40 °C
Oscillator Type	Internal
Package Length	0.295 in
Package Name	20-SOIC
Package Width	7.5 mm
Peripherals	PWM, POR, LVD
Program Memory Depth	16 K
Program Memory Size	16 KB
Program Memory Type	FLASH
Program Memory Width	8 bit
RAM Size Depth	512
RAM Size Width	8 bit
Speed	48 MHz
Voltage - Supply (Vcc/Vdd) Maximum	5.5 V
Voltage - Supply (Vcc/Vdd) Minimum	2.7 V

S08JS Series

Part	Core Processor	Package Name	Voltage - Supply (Vcc/Vdd) Minimum	Voltage - Supply (Vcc/Vdd) Maximum	Core Size (Bit Width)	Connectivity	RAM Size Depth	RAM Size Width	Package Length	Package Width	Number of I/O	Program Memory Type	Peripherals	Mounting Type	Operating Temperature (Max)	Operating Temperature (Min)	Program Memory Depth	Program Memory Width	Program Memory Size	Oscillator Type	Speed
NXP USA Inc. MC9S08JS16CWJ	S08	20-SOIC	2.7 V	5.5 V	8 Bit	LINbus SCI SPI USB	512	8 bit	0.295 in	7.5 mm	14	FLASH	LVD POR PWM	Surface Mount	85 °C	-40 °C	16 K	8 bit	16 KB	Internal	48 MHz

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

3D models and CAD resources for this part

General part information

Up to 24 MHz internal bus (48 MHz HCS08 core) frequency offering 2.7 to 5.5V across temperature range of -40°C to +85°C

Up to 16K flash read/program/erase over entire operating voltage and temperature ranges

Up to 512 bytes random access memory (RAM)

Technical documentation and resources