Zenode.ai Logo
Beta
TSSOP (DGG)
Integrated Circuits (ICs)

SN75976A1DGG

Active
Texas Instruments

NINE TRANSMITTER/RECEIVER RS-485 56-PIN TSSOP TUBE

Deep-Dive with AI

Search across all available documentation for this part.

TSSOP (DGG)
Integrated Circuits (ICs)

SN75976A1DGG

Active
Texas Instruments

NINE TRANSMITTER/RECEIVER RS-485 56-PIN TSSOP TUBE

Technical Specifications

Parameters and characteristics for this part

SpecificationSN75976A1DGG
DuplexHalf
Mounting TypeSurface Mount
Number of Drivers/Receivers [custom]9
Number of Drivers/Receivers [custom]9
Operating Temperature [Max]70 °C
Operating Temperature [Min]0 °C
Package / Case6.1 mm
Package / Case0.24 in
Package / Case56-TFSOP
ProtocolRS422, RS485
Receiver Hysteresis45 mV
Supplier Device Package56-TSSOP
TypeTransceiver
Voltage - Supply [Max]5.25 V
Voltage - Supply [Min]4.75 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyTube 70$ 21.27
Texas InstrumentsTUBE 1$ 20.56
100$ 17.96
250$ 13.85
1000$ 12.39

Description

General part information

SN75976A-EP Series

The SN75976A is an improved replacement for the industry's first 9-channel RS-485 transceiver -- the SN75LBC976. The A version offers improved switching performance, a smaller package, and higher ESD protection. The SN75976A is offered in two versions. The '976A2 skew limits of 4 ns for the differential drivers and 5 ns for the differential receivers complies with the recommended skew budget of the Fast-20 SCSI standard for data transfer rates up to 20 million transfers per second. The '976A1 supports the Fast SCSI skew budget for 10 million transfers per second. The skew limit ensures that the propagation delay times, not only from channel-to-channel but from device-to-device, are closely matched for the tight skew budgets associated with high-speed parallel data buses.

The patented thermal enhancements made to the 56-pin shrink small-outline package (SSOP) of the SN75976 have been applied to the new, thin shrink, small-outline package (TSSOP). The TSSOP package offers even less board area requirements than the SSOP while reducing the package height to 1 mm. This provides more board area and allows component mounting to both sides of the printed circuit boards for low-profile, space-restricted applications such as small form-factor hard disk drives.

In addition to speed improvements, the '976A can withstand electrostatic discharges exceeding 12 kV using the human-body model, and 600 V using the machine model of MIL-PRF-38535, Method 3015.7 on the RS-485 I/O terminals. This is six times the industry standard and provides protection from the noise that can be coupled into external cables. The other terminals of the device can withstand discharges exceeding 4 kV and 400 V respectively.