
Integrated Circuits (ICs)
SN74LVC2G00YZPR
ActiveTexas Instruments
2-CH, 2-INPUT, 1.65-V TO 5.5-V NAND GATES
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Integrated Circuits (ICs)
SN74LVC2G00YZPR
ActiveTexas Instruments
2-CH, 2-INPUT, 1.65-V TO 5.5-V NAND GATES
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Technical Specifications
Parameters and characteristics for this part
| Specification | SN74LVC2G00YZPR |
|---|---|
| Current - Output High, Low [x] | 32 mA |
| Current - Output High, Low [y] | 32 mA |
| Current - Quiescent (Max) [Max] | 10 µA |
| Input Logic Level - High [Max] | 3.85 V |
| Input Logic Level - High [Min] | 1.07 V |
| Input Logic Level - Low [Max] | 1.65 V |
| Input Logic Level - Low [Min] | 0.58 V |
| Logic Type | NAND Gate |
| Max Propagation Delay @ V, Max CL | 3.3 ns |
| Mounting Type | Surface Mount |
| Number of Circuits | 2 |
| Number of Inputs | 2 |
| Operating Temperature [Max] | 125 °C |
| Operating Temperature [Min] | -40 °C |
| Package / Case | 8-XFBGA, DSBGA |
| Supplier Device Package | 8-DSBGA |
| Voltage - Supply [Max] | 5.5 V |
| Voltage - Supply [Min] | 1.65 V |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
| Distributor | Package | Quantity | $ | |
|---|---|---|---|---|
| Digikey | Cut Tape (CT) | 1 | $ 0.90 | |
| 10 | $ 0.79 | |||
| 25 | $ 0.75 | |||
| 100 | $ 0.61 | |||
| 250 | $ 0.56 | |||
| 500 | $ 0.48 | |||
| 1000 | $ 0.38 | |||
| Digi-Reel® | 1 | $ 0.90 | ||
| 10 | $ 0.79 | |||
| 25 | $ 0.75 | |||
| 100 | $ 0.61 | |||
| 250 | $ 0.56 | |||
| 500 | $ 0.48 | |||
| 1000 | $ 0.38 | |||
| Tape & Reel (TR) | 3000 | $ 0.35 | ||
| 6000 | $ 0.32 | |||
| 15000 | $ 0.31 | |||
| 30000 | $ 0.30 | |||
| Texas Instruments | LARGE T&R | 1 | $ 0.68 | |
| 100 | $ 0.46 | |||
| 250 | $ 0.36 | |||
| 1000 | $ 0.24 | |||
Description
General part information
SN74LVC2G00W-EP Series
This dual 2-input positive-NAND gate is designed for 1.65-V to 5.5-V VCCoperation.
The SN74LVC2G00 device performs the Boolean function Y =A × Bor Y =A+Bin positive logic.
NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the package.
Documents
Technical documentation and resources