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Isolators

BM6112FV-CE2

NRND
Rohm Semiconductor

ISOLATION VOLTAGE 3750VRMS 1CH GATE DRIVER PROVIDING GALVANIC ISOLATION

Product dimension image
Isolators

BM6112FV-CE2

NRND
Rohm Semiconductor

ISOLATION VOLTAGE 3750VRMS 1CH GATE DRIVER PROVIDING GALVANIC ISOLATION

Technical Specifications

Parameters and characteristics for this part

SpecificationBM6112FV-CE2
Common Mode Transient Immunity (Min) [Min]100 V/ns
Mounting TypeSurface Mount
Number of Channels [custom]1
Operating Temperature [Max]125 °C
Operating Temperature [Min]-40 C
Package / Case28-SSOP
Package / Case [x]0.315 in
Package / Case [y]8 mm
Propagation Delay tpLH / tpHL (Max) [Max]150 ns
Pulse Width Distortion (Max) [Max]30 ns
Rise / Fall Time (Typ)30 ns
Rise / Fall Time (Typ)30 ns
Supplier Device Package28-SSOP-BW
TechnologyCapacitive Coupling
Voltage - Isolation3750 Vrms
Voltage - Output Supply [Max]20 V
Voltage - Output Supply [Min]14 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyCut Tape (CT) 1$ 10.06
10$ 6.99
25$ 6.20
100$ 5.32
250$ 4.89
500$ 4.63
Digi-Reel® 1$ 10.06
10$ 6.99
25$ 6.20
100$ 5.32
250$ 4.89
500$ 4.63
N/A 0$ 0.00
Tape & Reel (TR) 1500$ 4.33

Description

General part information

BM6112 Series

BM6112FV-C is a gate driver with isolation voltage of 3750Vrms, I/O delay time of 150ns, and incorporates fault signal output function, ready signal output function, under voltage lockout (UVLO) function, short circuit protection (SCP) function, active miller clamping function, output state feedback function and temperature monitor function.For sale of this product, please contact the specifications in our sales office. Currently, we don't sell this on the internet distributors now.

Documents

Technical documentation and resources

The Problem with Traditional Vaccine Storage Freezers and How ROHM Cutting-edge Power Solutions Can Take them to the Next Level

White Paper

Thermal Resistance

Thermal Design

Factory Information

Manufacturing Data

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

Basics of Thermal Resistance and Heat Dissipation

Thermal Design

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

Design Guide and Example of Stencil for Exposed Pad

Thermal Design

Solder Joint Rate and Thermal Resistance of Exposed Pad

Thermal Design

BM6112FV-C Data Sheet

Data Sheet

Heat Dissipation Effect of Thermal Via in Exposed Pad Type Package

Thermal Design

SSOP-B28W Package Information

Package Information

Precautions for Thermal Resistance of Insulation Sheet

Thermal Design

How to Use the Two-Resistor Model

Thermal Design

Judgment Criteria of Thermal Evaluation

Thermal Design

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

Cutting-Edge Web Simulation Tool "ROHM Solution Simulator" Capable of Complete Circuit Verification of Power Devices and Driver ICs

White Paper

How to Use the Thermal Resistance and Thermal Characteristics Parameters

Thermal Design

What Is Thermal Design

Thermal Design

θ<sub>JC</sub> and Ψ<sub>JT</sub>

Thermal Design

Five Steps for Successful Thermal Design of IC

White Paper

θ<sub>JA</sub> and Ψ<sub>JT</sub>

Thermal Design

Solving the challenges of driving SiC MOSFETs with new packaging developments

White Paper

PCB Layout Thermal Design Guide

Thermal Design