Specification	NCP302045MNTWG

Applications	Synchronous Buck Converters
Current - Output / Channel	45 A
Current - Peak Output	75 A
Fault Protection	Over Temperature, UVLO
Features	Bootstrap Circuit
Interface	Logic, PWM
Load Type	Capacitive, Inductive, Resistive
Mounting Type	Surface Mount
Operating Temperature [Max]	125 °C
Operating Temperature [Min]	-40 °C
Package / Case	31-PowerWFQFN
Supplier Device Package	31-PQFN (5x5)
Technology	MOSFET (Metal Oxide)
Voltage - Load [Max]	20 V
Voltage - Load [Min]	4.5 V
Voltage - Supply [Max]	5.5 V
Voltage - Supply [Min]	4.5 V

NCP302045 Series

Integrated Driver and MOSFETs, 45 A

Part	Voltage - Supply [Min]	Voltage - Supply [Max]	Mounting Type	Applications	Supplier Device Package	Voltage - Load [Min]	Voltage - Load [Max]	Current - Output / Channel	Package / Case	Fault Protection	Load Type	Features	Current - Peak Output	Operating Temperature [Min]	Operating Temperature [Max]	Technology	Interface
ON Semiconductor NCP302045MNTWG	4.5 V	5.5 V	Surface Mount	Synchronous Buck Converters	31-PQFN (5x5)	4.5 V	20 V	45 A	31-PowerWFQFN	Over Temperature UVLO	Capacitive Inductive Resistive	Bootstrap Circuit	75 A	-40 °C	125 °C	MOSFET (Metal Oxide)	Logic PWM

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	Cut Tape (CT)	1	$ 2.09
		10	$ 1.87
		25	$ 1.77
		100	$ 1.41
		250	$ 1.24
		500	$ 1.20
		1000	$ 0.95
	Digi-Reel®	1	$ 2.09
		10	$ 1.87
		25	$ 1.77
		100	$ 1.41
		250	$ 1.24
		500	$ 1.20
		1000	$ 0.95
	Tape & Reel (TR)	3000	$ 0.92
		6000	$ 0.88
Newark	Each (Supplied on Full Reel)	3000	$ 1.11
		6000	$ 1.05
		12000	$ 0.94
		18000	$ 0.91
		30000	$ 0.88
ON Semiconductor	N/A	1	$ 0.93

Description

General part information

NCP302045 Series

The NCP302045 integrates a MOSFET driver, high-side MOSFET and low-side MOSFET into a single package. The driver and MOSFETs have been optimized for high-current DC−DC buck power conversion applications. The NCP302045 integrated solution greatly reduces package parasitics and board space compared to a discrete component solution.