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ONSEMI MBT3904DW1T1H
Discrete Semiconductor Products

RUL035N02TR

Active
Rohm Semiconductor

MOSFET, N-CH, 20V, 3.5A, TUMT

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ONSEMI MBT3904DW1T1H
Discrete Semiconductor Products

RUL035N02TR

Active
Rohm Semiconductor

MOSFET, N-CH, 20V, 3.5A, TUMT

Technical Specifications

Parameters and characteristics for this part

SpecificationRUL035N02TR
Current - Continuous Drain (Id) @ 25°C3.5 A
Drain to Source Voltage (Vdss)20 V
Drive Voltage (Max Rds On, Min Rds On)1.5 V, 4.5 V
FET TypeN-Channel
Gate Charge (Qg) (Max) @ Vgs [Max]5.7 nC
Input Capacitance (Ciss) (Max) @ Vds460 pF
Mounting TypeSurface Mount
Operating Temperature150 °C
Package / Case6-SMD, Flat Leads
Power Dissipation (Max)320 mW
Rds On (Max) @ Id, Vgs43 mOhm
Supplier Device PackageTUMT6
TechnologyMOSFET (Metal Oxide)
Vgs (Max)10 V
Vgs(th) (Max) @ Id1 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyN/A 668$ 0.91
NewarkEach (Supplied on Cut Tape) 1$ 0.87
10$ 0.65
25$ 0.58
50$ 0.50
100$ 0.43
300$ 0.39
500$ 0.34
1000$ 0.31

Description

General part information

RUL035N02 Series

Power MOSFETs are made as low ON-resistance devices by the micro-processing technologies useful for wide range of applications. Broad lineup covering compact types, high-power types and complex types to meet various needs in the market.

Documents

Technical documentation and resources

Technical Data Sheet EN

Datasheet

Anti-Whisker formation - Transistors

Package Information

Moisture Sensitivity Level - Transistors

Package Information

Certificate of not containing SVHC under REACH Regulation

Environmental Data

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

What Is Thermal Design

Thermal Design

How to Use LTspice® Models: Tips for Improving Convergence

Schematic Design & Verification

About Flammability of Materials

Environmental Data

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

MOSFET Gate Resistor Setting for Motor Driving

Technical Article

Condition of Soldering / Land Pattern Reference

Package Information

How to Use LTspice® Models

Schematic Design & Verification

Method for Monitoring Switching Waveform

Schematic Design & Verification

About Export Regulations

Export Information

PCB Layout Thermal Design Guide

Thermal Design

Notes for Temperature Measurement Using Forward Voltage of PN Junction

Thermal Design

Part Explanation

Application Note

Reliability Test Result

Manufacturing Data

What is a Thermal Model? (Transistor)

Thermal Design

Two-Resistor Model for Thermal Simulation

Thermal Design

MOSFET Gate Drive Current Setting for Motor Driving

Technical Article

Package Dimensions

Package Information

Inner Structure

Package Information

List of Transistor Package Thermal Resistance

Thermal Design

Taping Information

Package Information

How to Create Symbols for PSpice Models

Models

Calculation of Power Dissipation in Switching Circuit

Schematic Design & Verification

Types and Features of Transistors

Application Note

Temperature derating method for Safe Operating Area (SOA)

Schematic Design & Verification

ESD Data

Characteristics Data

Notes for Calculating Power Consumption:Static Operation

Thermal Design

Notes for Temperature Measurement Using Thermocouples

Thermal Design

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

Basics of Thermal Resistance and Heat Dissipation

Thermal Design

Explanation for Marking

Package Information

Precautions When Measuring the Rear of the Package with a Thermocouple

Thermal Design

Compliance of the RoHS directive

Environmental Data

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design