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Integrated Circuits (ICs)

BDJ2FA1FP3-ZTL

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Rohm Semiconductor

100MA 12V, FIXED OUTPUT, HIGH-ACCURACY LDO REGULATOR

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Integrated Circuits (ICs)

BDJ2FA1FP3-ZTL

Active
Rohm Semiconductor

100MA 12V, FIXED OUTPUT, HIGH-ACCURACY LDO REGULATOR

Technical Specifications

Parameters and characteristics for this part

SpecificationBDJ2FA1FP3-ZTL
Current - Output100 mA
Current - Supply (Max) [Max]600 µA
Mounting TypeSurface Mount
Number of Regulators1
Operating Temperature [Max]85 C
Operating Temperature [Min]-25 °C
Output ConfigurationPositive
Output Type1.81 mOhm
Package / CaseTO-243AA
Protection FeaturesOver Current
Supplier Device PackageSOT-89-3
Voltage - Input (Max) [Max]25 V
Voltage - Output (Min/Fixed)12 V
Voltage Dropout (Max) [Max]3 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyCut Tape (CT) 1$ 0.57
10$ 0.48
25$ 0.45
100$ 0.36
250$ 0.34
500$ 0.28
Digi-Reel® 1$ 0.57
10$ 0.48
25$ 0.45
100$ 0.36
250$ 0.34
500$ 0.28
Tape & Reel (TR) 1000$ 0.16

Description

General part information

BDJ2FA1FP3 Series

BDJ2FA1FP3 is an LDO regulator with output current capability of 0.1A. The output voltage is 12.0V with ±1% accuracy. The SOT89-3K package is most suitable for heat dissipation. As protective function to prevent IC from destruction, this chip has built-in over current protection circuit to protect the device when output is shorted, and built-in thermal shutdown circuit to protect the IC during thermal over load conditions. This product can be used in wide variety of digital appliances. This regulator can use ceramic capacitor, which have smaller size and longer life than other capacitors.

Documents

Technical documentation and resources

Reverse Voltage Protection

Schematic Design & Verification

BDxxFA1 Series PCB Layout

Schematic Design & Verification

Table of resistance for output voltage setting on linear regulator Ics

Schematic Design & Verification

What Is Thermal Design

Thermal Design

UL94 Flame Classifications of Mold Compound

Environmental Data

How to Select Reverse Current Protection Diodes for LDO Regulators

Schematic Design & Verification

Basics of Linear Regulators

Schematic Design & Verification

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

SOT89-3K Package Information

Package Information

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

Measurement Method for Phase Margin with Frequency Response Analyzer (FRA)

Schematic Design & Verification

Solder Joint Rate and Thermal Resistance of Exposed Pad

Thermal Design

Judgment Criteria of Thermal Evaluation

Thermal Design

Compliance with the ELV directive

Environmental Data

Design Guide and Example of Stencil for Exposed Pad

Thermal Design

Factory Information

Manufacturing Data

Anti-Whisker formation

Package Information

Suppression Method of Switching Noise Using Linear Regulator and Low Pass Filter

Schematic Design & Verification

Five Steps for Successful Thermal Design of IC

White Paper

Power Source ON/OFF Characteristics for Linear Regulator

Schematic Design & Verification

How to Use the Thermal Resistance and Thermal Characteristics Parameters

Thermal Design

Thermal Resistance

Thermal Design

Power Supply Sequence Circuit with General Purpose Power Supply IC

Schematic Design & Verification

Problem Situations: Power Supply Does Not Start

Schematic Design & Verification

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

Usage of SPICE Macromodel (for LDO)

Schematic Design & Verification

Six Steps for Successful Thermal Design of LDO Regulator ICs

White Paper

Calculating Junction Temperature from Inrush Current

Thermal Design

Connecting LDOs in Parallel

Schematic Design & Verification

PCB Layout Thermal Design Guide

Thermal Design

EMC Measures for LDOs

Schematic Design & Verification

θ<sub>JA</sub> and Ψ<sub>JT</sub>

Thermal Design

Heat Dissipation Effect of Thermal Via in Exposed Pad Type Package

Thermal Design