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Discrete Semiconductor Products

BSS63AT116

Active
Rohm Semiconductor

PNP, SOT-23, -100V -100MA, HIGH-VOLTAGE AMPLIFIER TRANSISTOR

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Product dimension image
Discrete Semiconductor Products

BSS63AT116

Active
Rohm Semiconductor

PNP, SOT-23, -100V -100MA, HIGH-VOLTAGE AMPLIFIER TRANSISTOR

Technical Specifications

Parameters and characteristics for this part

SpecificationBSS63AT116
Current - Collector (Ic) (Max) [Max]100 mA
Current - Collector Cutoff (Max) [Max]100 nA
DC Current Gain (hFE) (Min) @ Ic, Vce [Min]30
Frequency - Transition200 MHz
Mounting TypeSurface Mount
Operating Temperature150 °C
Package / CaseSOT-23-3, TO-236-3, SC-59
Power - Max [Max]200 mW
Supplier Device PackageSST3
Transistor TypePNP
Vce Saturation (Max) @ Ib, Ic500 mV
Voltage - Collector Emitter Breakdown (Max) [Max]100 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyCut Tape (CT) 1$ 0.35
10$ 0.24
100$ 0.12
500$ 0.10
1000$ 0.07
Digi-Reel® 1$ 0.35
10$ 0.24
100$ 0.12
500$ 0.10
1000$ 0.07
N/A 2554$ 0.32
Tape & Reel (TR) 3000$ 0.04
6000$ 0.04
9000$ 0.04

Description

General part information

BSS63A Series

Bipolar (BJT) Transistor PNP 100 V 100 mA 200MHz 200 mW Surface Mount SST3

Documents

Technical documentation and resources

List of Transistor Package Thermal Resistance

Thermal Design

Anti-Whisker formation - Transistors

Package Information

Method for Monitoring Switching Waveform

Schematic Design & Verification

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

About Flammability of Materials

Environmental Data

Basics of Thermal Resistance and Heat Dissipation

Thermal Design

Types and Features of Transistors

Application Note

What is a Thermal Model? (Transistor)

Thermal Design

Two-Resistor Model for Thermal Simulation

Thermal Design

Reliability Test Result

Manufacturing Data

Compliance of the RoHS directive

Environmental Data

Taping Information

Package Information

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

PCB Layout Thermal Design Guide

Thermal Design

How to Use LTspice® Models: Tips for Improving Convergence

Schematic Design & Verification

BSS63A Data Sheet

Data Sheet

Temperature derating method for Safe Operating Area (SOA)

Schematic Design & Verification

Notes for Calculating Power Consumption:Static Operation

Thermal Design

What Is Thermal Design

Thermal Design

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

Precautions When Measuring the Rear of the Package with a Thermocouple

Thermal Design

Certificate of not containing SVHC under REACH Regulation

Environmental Data

Condition of Soldering / Land Pattern Reference

Package Information

Calculation of Power Dissipation in Switching Circuit

Schematic Design & Verification

About Export Regulations

Export Information

Moisture Sensitivity Level - Transistors

Package Information

Package Dimensions

Package Information

How to Create Symbols for PSpice Models

Models

Explanation for Marking

Package Information

Part Explanation

Application Note

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

Notes for Temperature Measurement Using Forward Voltage of PN Junction

Thermal Design

Notes for Temperature Measurement Using Thermocouples

Thermal Design

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

How to Use LTspice® Models

Schematic Design & Verification