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Discrete Semiconductor Products

RSH065N06TB1

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Rohm Semiconductor

MOSFET N-CH 60V 6.5A 8SOP

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Product dimension image
Discrete Semiconductor Products

RSH065N06TB1

Active
Rohm Semiconductor

MOSFET N-CH 60V 6.5A 8SOP

Technical Specifications

Parameters and characteristics for this part

SpecificationRSH065N06TB1
Current - Continuous Drain (Id) @ 25°C6.5 A
Drain to Source Voltage (Vdss)60 V
Drive Voltage (Max Rds On, Min Rds On) [Max]4 V
Drive Voltage (Max Rds On, Min Rds On) [Min]10 V
FET TypeN-Channel
Input Capacitance (Ciss) (Max) @ Vds900 pF
Mounting TypeSurface Mount
Operating Temperature150 °C
Package / Case0.154 in
Package / Case8-SOIC
Package / Case3.9 mm
Power Dissipation (Max)2 W
Rds On (Max) @ Id, Vgs37 mOhm
Supplier Device Package8-SOP
TechnologyMOSFET (Metal Oxide)
Vgs (Max) [Max]20 V
Vgs(th) (Max) @ Id2.5 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyCut Tape (CT) 1$ 1.35
10$ 1.11
100$ 0.86
500$ 0.73
1000$ 0.59
Digi-Reel® 1$ 1.35
10$ 1.11
100$ 0.86
500$ 0.73
1000$ 0.59
N/A 2520$ 1.43
Tape & Reel (TR) 2500$ 0.51

Description

General part information

RSH065N06 Series

Power MOSFETs are made as low ON-resistance devices by the micro-processing technologies useful for wide range of applications. Broad lineup covering compact types, high-power types and complex types to meet various needs in the market.

Documents

Technical documentation and resources

Temperature derating method for Safe Operating Area (SOA)

Schematic Design & Verification

Calculation of Power Dissipation in Switching Circuit

Schematic Design & Verification

RSH065N06 Data Sheet

Data Sheet

Precautions When Measuring the Rear of the Package with a Thermocouple

Thermal Design

MOSFET Gate Drive Current Setting for Motor Driving

Technical Article

Notes for Temperature Measurement Using Forward Voltage of PN Junction

Thermal Design

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

ESD Data

Characteristics Data

Certificate of not containing SVHC under REACH Regulation

Environmental Data

MOSFET Gate Resistor Setting for Motor Driving

Technical Article

Moisture Sensitivity Level - Transistors

Package Information

Explanation for Marking

Package Information

Method for Monitoring Switching Waveform

Schematic Design & Verification

Condition of Soldering / Land Pattern Reference

Package Information

Reliability Test Result

Manufacturing Data

Taping Information

Package Information

Compliance of the RoHS directive

Environmental Data

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

Notes for Temperature Measurement Using Thermocouples

Thermal Design

What is a Thermal Model? (Transistor)

Thermal Design

Basics of Thermal Resistance and Heat Dissipation

Thermal Design

PCB Layout Thermal Design Guide

Thermal Design

Inner Structure

Package Information

Anti-Whisker formation - Transistors

Package Information

Package Dimensions

Package Information

About Flammability of Materials

Environmental Data

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

What Is Thermal Design

Thermal Design

How to Create Symbols for PSpice Models

Models

Two-Resistor Model for Thermal Simulation

Thermal Design

About Export Regulations

Export Information

Types and Features of Transistors

Application Note

Notes for Calculating Power Consumption:Static Operation

Thermal Design

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

How to Use LTspice® Models

Schematic Design & Verification

Part Explanation

Application Note

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

List of Transistor Package Thermal Resistance

Thermal Design

Constitution Materials List

Environmental Data

How to Use LTspice® Models: Tips for Improving Convergence

Schematic Design & Verification