SN74AUP3G07RSER
Active3-CH, 0.8-V TO 3.6-V LOW POWER BUFFERS WITH OPEN-DRAIN OUTPUTS
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SN74AUP3G07RSER
Active3-CH, 0.8-V TO 3.6-V LOW POWER BUFFERS WITH OPEN-DRAIN OUTPUTS
Deep-Dive with AI
Technical Specifications
Parameters and characteristics for this part
| Specification | SN74AUP3G07RSER |
|---|---|
| Current - Output High, Low | - |
| Current - Output High, Low | 4 mA |
| Logic Type | Buffer, Non-Inverting |
| Mounting Type | Surface Mount |
| Number of Bits per Element | 1 |
| Operating Temperature [Max] | 85 °C |
| Operating Temperature [Min] | -40 °C |
| Output Type | Open Drain |
| Package / Case | 8-UFQFN |
| Supplier Device Package | 8-UQFN (1.5x1.5) |
| Voltage - Supply [Max] | 3.6 V |
| Voltage - Supply [Min] | 0.8 V |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
| Distributor | Package | Quantity | $ | |
|---|---|---|---|---|
| Digikey | Cut Tape (CT) | 1 | $ 0.60 | |
| 10 | $ 0.52 | |||
| 25 | $ 0.48 | |||
| 100 | $ 0.38 | |||
| 250 | $ 0.36 | |||
| 500 | $ 0.30 | |||
| 1000 | $ 0.23 | |||
| 2500 | $ 0.21 | |||
| Digi-Reel® | 1 | $ 0.60 | ||
| 10 | $ 0.52 | |||
| 25 | $ 0.48 | |||
| 100 | $ 0.38 | |||
| 250 | $ 0.36 | |||
| 500 | $ 0.30 | |||
| 1000 | $ 0.23 | |||
| 2500 | $ 0.21 | |||
| Tape & Reel (TR) | 5000 | $ 0.20 | ||
| 10000 | $ 0.19 | |||
| 25000 | $ 0.18 | |||
| 50000 | $ 0.17 | |||
| Texas Instruments | LARGE T&R | 1 | $ 0.34 | |
| 100 | $ 0.26 | |||
| 250 | $ 0.19 | |||
| 1000 | $ 0.14 | |||
Description
General part information
SN74AUP3G07 Series
The AUP family is TI’s premier solution to the industry's low-power needs in battery-powered portable applications. This family ensures a very low static- and dynamic-power consumption across the entire VCCrange of 0.8 V to 3.6 V, resulting in increased battery life (see ). This product also maintains excellent signal integrity.
The output of SN74AUP3G07 is open drain and can be connected to other open-drain outputs to implement active-low wired-OR or active-high wired-AND functions.
NanoStar™ package technology is a major breakthrough in IC packaging concepts, using the die as the package.
Documents
Technical documentation and resources
