Connectors, Interconnects

MTB1-25SL82

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ITT Cannon, LLC

CONN 25POS 0.05 GOLD PCB

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Connectors, Interconnects

MTB1-25SL82

Active

ITT Cannon, LLC

CONN 25POS 0.05 GOLD PCB

Deep-Dive with AI

DocumentsDatasheet

Specifications Series Pricing Description Documents

Technical Specifications

Parameters and characteristics for this part

Specification	MTB1-25SL82

Contact Finish - Mating	Gold
Contact Finish Thickness - Mating	50 µin
Contact Finish Thickness - Mating	1.27 µm
Contact Material	Copper Alloy
Contact Shape	Circular
Contact Type	Socket
Current Rating (Amps)	3 A
Insulation Material	Diallyl Phthalate (DAP)
Mounting Type	Through Hole
Number of Positions	25
Number of Positions Loaded	All
Number of Rows	1
Operating Temperature [Max]	150 °C
Operating Temperature [Min]	-55 C
Pitch - Mating	1.27 mm
Pitch - Mating	0.05 in
Style	Cable, Board to Board
Termination	Solder

MTB1 Series

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Part	Connector Type	Operating Temperature [Min]	Operating Temperature [Max]	Mounting Type	Current Rating (Amps)	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Insulation Material	Fastening Type	Number of Positions	Number of Positions Loaded	Shrouding	Insulation Height	Insulation Height	Pitch - Mating	Pitch - Mating	Contact Material	Contact Type	Number of Rows	Contact Shape	Contact Finish - Mating	Termination	Style	Features	Contact Finish Thickness	Contact Finish Thickness	Contact Finish	Cable Termination	Wire Gauge [Min]	Wire Gauge [Max]	Wire Type	Pitch	Pitch	Pitch - Connector	Pitch - Connector	Shielding	Length	Length	Color	Length [x]	Length [x]
ITT Cannon, LLC MTB1-6PL95	Header	-55 C	150 °C	Through Hole	3 A	50 µin	1.27 µm	Diallyl Phthalate (DAP)	Push-Pull	6	All	Unshrouded	0.1 in	2.54 mm	1.27 mm	0.05 in	Copper Alloy	Male Pin	1	Circular	Gold	Solder	Board to Cable/Wire
ITT Cannon, LLC MTB1-10PAL1-01	Header	-55 C	150 °C	Right Angle Through Hole	3 A	50 µin	1.27 µm	Diallyl Phthalate (DAP)	Push-Pull	10	All	Unshrouded	0.1 in	2.54 mm	1.27 mm	0.05 in	Copper Alloy	Male Pin	1	Circular	Gold	Solder	Board to Cable/Wire	Guide Pin
ITT Cannon, LLC MTB1-5PS1				Free Hanging (In-Line)					Push-Pull	5								Male Pin	1						50 µin	1.27 µm	Gold	Solder	24 AWG	32 AWG	Discrete	0.05 in	1.27 mm
ITT Cannon, LLC MTB1-81PL1	Header	-55 C	150 °C	Through Hole	3 A	50 µin	1.27 µm	Diallyl Phthalate (DAP)	Push-Pull	8	All	Unshrouded	0.1 in	2.54 mm	1.27 mm	0.05 in	Copper Alloy	Male Pin	1	Circular	Gold	Solder	Board to Cable/Wire
ITT Cannon, LLC MTB1-41PH011	Plug to Individual Wire Leads									41															50 µin	1.27 µm	Gold	Crimp						0.05 "	1.27 mm	Unshielded	91.44 cm	3 ft	Individual Yellow
ITT Cannon, LLC MTB1-2PH003	Plug to Individual Wire Leads									2															50 µin	1.27 µm	Gold	Crimp						0.05 "	1.27 mm	Unshielded			Individual Multiple	457.2 mm	1.5 ft
ITT Cannon, LLC MTB1-25SL82		-55 C	150 °C	Through Hole	3 A	50 µin	1.27 µm	Diallyl Phthalate (DAP)		25	All				1.27 mm	0.05 in	Copper Alloy	Socket	1	Circular	Gold	Solder	Board to Board Cable
ITT Cannon, LLC MTB1-3PAL79	Header	-55 C	150 °C	Right Angle Through Hole	3 A	50 µin	1.27 µm	Diallyl Phthalate (DAP)	Push-Pull		All	Unshrouded	0.1 in	2.54 mm	1.27 mm	0.05 in	Copper Alloy	Male Pin	1	Circular	Gold	Solder	Board to Cable/Wire
ITT Cannon, LLC MTB1-32PL1	Header	-55 C	150 °C	Through Hole	3 A	50 µin	1.27 µm	Diallyl Phthalate (DAP)	Push-Pull		All	Unshrouded	0.1 in	2.54 mm	1.27 mm	0.05 in	Copper Alloy	Male Pin	1	Circular	Gold	Solder	Board to Cable/Wire
ITT Cannon, LLC MTB1-16PAL79	Header	-55 C	150 °C	Right Angle Through Hole	3 A	50 µin	1.27 µm	Diallyl Phthalate (DAP)	Push-Pull	16	All	Unshrouded	0.1 in	2.54 mm	1.27 mm	0.05 in	Copper Alloy	Male Pin	1	Circular	Gold	Solder	Board to Cable/Wire

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	Bulk	10	$ 160.43
	N/A	0	$ 160.43
Newark	Each	10	$ 152.46
		25	$ 146.32
		50	$ 138.14
		100	$ 136.09

Description

General part information

MTB1 Series

25 Position Connector 0.050" (1.27mm) Through Hole Gold

Documents

Technical documentation and resources