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ROHM RB088LAM150TFTR
Discrete Semiconductor Products

RFN1VWM2STFTR

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Rohm Semiconductor

200V 1A 14NS, PMDE, ULTRA FAST RECOVERY DIODE FOR AUTOMOTIVE

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ROHM RB088LAM150TFTR
Discrete Semiconductor Products

RFN1VWM2STFTR

Active
Rohm Semiconductor

200V 1A 14NS, PMDE, ULTRA FAST RECOVERY DIODE FOR AUTOMOTIVE

Technical Specifications

Parameters and characteristics for this part

SpecificationRFN1VWM2STFTR
Current - Average Rectified (Io)1 A
Current - Reverse Leakage @ Vr1 µA
Mounting TypeSurface Mount
Operating Temperature - Junction175 °C
Package / Case2-SMD, Flat Leads
Reverse Recovery Time (trr)25 ns
Speed500 ns, 200 mA
Supplier Device PackagePMDE
TechnologyStandard
Voltage - DC Reverse (Vr) (Max) [Max]200 V
Voltage - Forward (Vf) (Max) @ If [Max]930 mV

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyCut Tape (CT) 1$ 0.92
10$ 0.57
100$ 0.37
500$ 0.29
1000$ 0.26
Digi-Reel® 1$ 0.92
10$ 0.57
100$ 0.37
500$ 0.29
1000$ 0.26
N/A 1656$ 0.69
Tape & Reel (TR) 3000$ 0.22
6000$ 0.21
9000$ 0.20
15000$ 0.19
21000$ 0.18
30000$ 0.18
NewarkEach 1$ 0.85
10$ 0.58
100$ 0.38
500$ 0.29
1000$ 0.26
2500$ 0.23
12000$ 0.18

Description

General part information

RFN1VWM2 Series

RFN1VWM2S is a diode with excellent trr, which is important for high frequency operation, and achieves the same electrical characteristics as conventional ROHM products in the small PMDE package. PMDE package is highly reliable and has excellent heat dissipation efficiency.

Documents

Technical documentation and resources

Technical Data Sheet EN

Datasheet

Report of SVHC under REACH Regulation

Environmental Data

Part Explanation

Application Note

PCB Layout Thermal Design Guide

Thermal Design

Precautions When Measuring the Rear of the Package with a Thermocouple

Thermal Design

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

How to Use LTspice® Models: Tips for Improving Convergence

Schematic Design & Verification

Diode Types and Applications

Technical Article

What Is Thermal Design

Thermal Design

Taping Information

Package Information

Package Dimensions

Package Information

Notes for Calculating Power Consumption:Static Operation

Thermal Design

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

List of Diode Package Thermal Resistance

Thermal Design

How to Use the Thermal Resistance and Thermal Characteristics Parameters

Thermal Design

Absolute Maximum Rating and Electrical Characteristics of Diodes

Technical Article

Two-Resistor Model for Thermal Simulation

Thermal Design

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

About Export Regulations

Export Information

Inner Structure

Package Information

How to Select Reverse Current Protection Diodes for LDO Regulators

Schematic Design & Verification

Reliability Test Result

Manufacturing Data

About Flammability of Materials

Environmental Data

How to Use LTspice® Models

Schematic Design & Verification

How to Select Rectifier Diodes

Technical Article

Moisture Sensitivity Level - Diodes

Package Information

Method for Monitoring Switching Waveform

Schematic Design & Verification

Judgment Criteria of Thermal Evaluation

Thermal Design

θ<sub>JA</sub> and Ψ<sub>JT</sub>

Thermal Design

Power Loss and Thermal Design of Diodes

Thermal Design

What is a Thermal Model? (Diode)

Thermal Design

θ<sub>JC</sub> and Ψ<sub>JT</sub>

Thermal Design

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

Notes for Temperature Measurement Using Forward Voltage of PN Junction

Thermal Design

Compliance of the RoHS directive

Environmental Data

Notes for Temperature Measurement Using Thermocouples

Thermal Design

Advantages of PMDE Compact Package with High Heat Dissipation for Automotive Schottky Barrier Diodes

Technical Article

Anti-Whisker formation - Diodes

Package Information

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

RFN1VWM2STF Data Sheet

Data Sheet

Basics of Thermal Resistance and Heat Dissipation

Thermal Design

Explanation for Marking

Package Information

Condition of Soldering / Land Pattern Reference

Package Information