Integrated Circuits (ICs)

MC33PF3000A6ES

Active

POWER MANAGEMENT IC I.MX7 PRE-

Search across all available documentation for this part.

Integrated Circuits (ICs)

Active

POWER MANAGEMENT IC I.MX7 PRE-

Technical Specifications

Parameters and characteristics for this part

Specification	MC33PF3000A6ES

Applications	i.MX Processors
Mounting Type	Wettable Flank, Surface Mount
Operating Temperature [Max]	105 ░C
Operating Temperature [Min]	-40 °C
Package / Case	48-VFQFN Exposed Pad
Supplier Device Package	48-QFN (7x7)

MC33PF3000 Series

Part	Applications	Mounting Type	Package / Case	Operating Temperature [Min]	Operating Temperature [Max]	Supplier Device Package
Freescale Semiconductor - NXP MC33PF3000A5ESR2	i.MX Processors	Surface Mount Wettable Flank	48-VFQFN Exposed Pad	-40 °C	105 ░C	48-QFN (7x7)
Freescale Semiconductor - NXP MC33PF3000A4ESR2	i.MX Processors	Surface Mount Wettable Flank	48-VFQFN Exposed Pad	-40 °C	105 ░C	48-QFN (7x7)
Freescale Semiconductor - NXP MC33PF3000A4ES	i.MX Processors	Surface Mount Wettable Flank	48-VFQFN Exposed Pad	-40 °C	105 ░C	48-QFN (7x7)
Freescale Semiconductor - NXP MC33PF3000A6ES	i.MX Processors	Surface Mount Wettable Flank	48-VFQFN Exposed Pad	-40 °C	105 ░C	48-QFN (7x7)
Freescale Semiconductor - NXP MC33PF3000A3ES	i.MX Processors	Surface Mount Wettable Flank	48-VFQFN Exposed Pad	-40 °C	105 ░C	48-QFN (7x7)

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	Tray	260	$ 6.51

General part information

Power Management IC for IMX6 5V 4 Buck + 1 Boost + 6 LDO, Automotive

Technical documentation and resources