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Discrete Semiconductor Products

RGT20TM65DGC9

Active
Rohm Semiconductor

5ΜS SHORT-CIRCUIT TOLERANCE, 650V 10A, FRD BUILT-IN, TO-220NFM, FIELD STOP TRENCH IGBT

Product thumbnail image
Discrete Semiconductor Products

RGT20TM65DGC9

Active
Rohm Semiconductor

5ΜS SHORT-CIRCUIT TOLERANCE, 650V 10A, FRD BUILT-IN, TO-220NFM, FIELD STOP TRENCH IGBT

Technical Specifications

Parameters and characteristics for this part

SpecificationRGT20TM65DGC9
Current - Collector Pulsed (Icm)30 A
Gate Charge22 nC
IGBT TypeTrench Field Stop
Mounting TypeThrough Hole
Operating Temperature [Max]175 °C
Operating Temperature [Min]-40 C
Package / CaseTO-220-3 Full Pack
Power - Max [Max]25 W
Reverse Recovery Time (trr)42 ns
Supplier Device PackageTO-220NFM
Td (on/off) @ 25°C32 ns
Td (on/off) @ 25°C12 ns
Test Condition400 V, 10 A, 10 Ohm, 15 V
Vce(on) (Max) @ Vge, Ic2.1 V
Voltage - Collector Emitter Breakdown (Max)650 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyTube 1000$ 1.20
NewarkEach 1$ 2.96
10$ 2.66
100$ 2.14
500$ 1.76
1000$ 1.15

Description

General part information

RGT20TM65D Series

RGT20TM65D is a Field Stop Trench IGBT with low collector - emitter saturation voltage, suitable for General Inverter, UPS, Power Conditioner, Welder.

Documents

Technical documentation and resources

Semikron Danfoss: Partnering for the Safe Supply of Industrial Power Modules

White Paper

How to Use the Thermal Resistance and Thermal Characteristics Parameters

Thermal Design

Package Dimensions

Package Information

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

θ<sub>JA</sub> and Ψ<sub>JT</sub>

Thermal Design

How to Use LTspice&reg; Models: Tips for Improving Convergence

Schematic Design & Verification

Example of Heat Dissipation Design for TO Packages: Effect of Heat Dissipation Materials

Thermal Design

Anti-Whisker formation

Package Information

Generation Mechanism of Voltage Surge on Commutation Side (Basic)

Technical Article

Method for Monitoring Switching Waveform

Schematic Design & Verification

Two-Resistor Model for Thermal Simulation

Thermal Design

Types and Features of Transistors

Application Note

Precautions for Thermal Resistance of Insulation Sheet

Thermal Design

PCB Layout Thermal Design Guide

Thermal Design

About Export Administration Regulations (EAR)

Export Information

About Flammability of Materials

Environmental Data

The Problem with Traditional Vaccine Storage Freezers and How ROHM Cutting-edge Power Solutions Can Take them to the Next Level

White Paper

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

Notes for Temperature Measurement Using Thermocouples

Thermal Design

Judgment Criteria of Thermal Evaluation

Thermal Design

4 Steps for Successful Thermal Designing of Power Devices

White Paper

Compliance of the ELV directive

Environmental Data

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

Moisture Sensitivity Level

Package Information

Power Eco Family: Overview of ROHM's Power Semiconductor Lineup

White Paper

What Is Thermal Design

Thermal Design