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Technical Specifications
Parameters and characteristics for this part
| Specification | ESQT-113-02-GF-D-310 |
|---|---|
| Connector Type | Elevated Socket |
| Contact Finish - Mating | Gold |
| Contact Finish - Post | Gold |
| Contact Finish Thickness - Mating | 0.51 µm |
| Contact Finish Thickness - Mating | 20 µin |
| Contact Finish Thickness - Post | 3 µin |
| Contact Finish Thickness - Post | 0.076 µm |
| Contact Length - Post | 0.54 in |
| Contact Length - Post | 13.72 mm |
| Contact Material | Phosphor Bronze |
| Contact Shape | Square |
| Contact Type | Forked |
| Current Rating (Amps) | 4.5 A |
| Fastening Type | Push-Pull |
| Insulation Color | Black |
| Insulation Height | 0.31 in |
| Insulation Height | 7.87 mm |
| Insulation Material | Liquid Crystal Polymer (LCP) |
| Material Flammability Rating | UL94 V-0 |
| Mounting Type | Through Hole |
| Number of Positions | 26 |
| Number of Positions Loaded | All |
| Number of Rows | 2 |
| Operating Temperature [Max] | 125 °C |
| Operating Temperature [Min] | -55 °C |
| Pitch - Mating [x] | 0.079 in |
| Pitch - Mating [x] | 2 mm |
| Row Spacing - Mating | 0.079 in |
| Row Spacing - Mating | 2 mm |
| Style | Board to Board, Cable |
| Termination | Solder |
...
| Part | Operating Temperature [Min] | Operating Temperature [Max] | Insulation Material | Contact Finish - Post | Contact Length - Post | Contact Length - Post | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Contact Finish - Mating | Insulation Color | Fastening Type | Material Flammability Rating | Termination | Number of Positions | Contact Material | Pitch - Mating [x] | Pitch - Mating [x] | Style | Insulation Height | Insulation Height | Mounting Type | Row Spacing - Mating | Row Spacing - Mating | Number of Positions Loaded | Current Rating (Amps) | Contact Shape | Connector Type | Contact Type | Contact Length - Post [x] | Contact Length - Post [x] | Number of Rows | Contact Finish Thickness - Post | Contact Finish Thickness - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Samtec Inc. | -55 °C | 125 °C | Liquid Crystal Polymer (LCP) | Tin | 0.09 " | 2.29 mm | 0.51 µm | 20 µin | Gold | Black | Push-Pull | UL94 V-0 | Solder | 52 | Phosphor Bronze | 0.079 in | 2 mm | Board to Board Cable | 9.35 mm | 0.368 in | Through Hole | 0.079 in | 2 mm | All | 4.5 A | Square | Elevated Socket | Forked | |||||
Samtec Inc. | -55 °C | 125 °C | Liquid Crystal Polymer (LCP) | Tin | 0.25 çm | 10 çin | Gold | Black | Push-Pull | UL94 V-0 | Solder | 13 | Phosphor Bronze | 0.079 in | 2 mm | Board to Board Cable | 8.51 mm | 0.335 " | Through Hole | All | 4.5 A | Square | Elevated Socket | Forked | 3.12 mm | 0.123 in | 1 | ||||||
Samtec Inc. | -55 °C | 125 °C | Liquid Crystal Polymer (LCP) | Gold | 0.54 in | 13.72 mm | 0.51 µm | 20 µin | Gold | Black | Push-Pull | UL94 V-0 | Solder | 26 | Phosphor Bronze | 0.079 in | 2 mm | Board to Board Cable | 7.87 mm | 0.31 in | Through Hole | 0.079 in | 2 mm | All | 4.5 A | Square | Elevated Socket | Forked | 2 | 3 µin | 0.076 µm | ||
Samtec Inc. | -55 °C | 125 °C | Liquid Crystal Polymer (LCP) | Tin | 0.09 " | 2.29 mm | 0.076 µm | 3 µin | Gold | Black | Push-Pull | UL94 V-0 | Solder | 26 | Phosphor Bronze | 0.079 in | 2 mm | Board to Board Cable | 9.35 mm | 0.368 in | Through Hole | 0.079 in | 2 mm | All | 4.5 A | Square | Elevated Socket | Forked | 2 | ||||
Samtec Inc. | -55 °C | 125 °C | Liquid Crystal Polymer (LCP) | Tin | 0.133 in | 3.38 mm | 0.25 çm | 10 çin | Gold | Black | Push-Pull | UL94 V-0 | Solder | 26 | Phosphor Bronze | 0.079 in | 2 mm | Board to Board Cable | 8.25 mm | 0.325 in | Through Hole | 0.079 in | 2 mm | All | 4.5 A | Square | Elevated Socket | Forked | 2 | ||||
Samtec Inc. | -55 °C | 125 °C | Liquid Crystal Polymer (LCP) | Tin | 0.25 çm | 10 çin | Gold | Black | Push-Pull | UL94 V-0 | Solder | 26 | Phosphor Bronze | 0.079 in | 2 mm | Board to Board Cable | 12.7 mm | 0.5 in | Through Hole | 0.079 in | 2 mm | All | 4.5 A | Square | Elevated Socket | Forked | 8.89 mm | 0.35 in | 2 | ||||
Samtec Inc. | -55 °C | 125 °C | Liquid Crystal Polymer (LCP) | Tin | 0.425 in | 10.8 mm | 0.25 çm | 10 çin | Gold | Black | Push-Pull | UL94 V-0 | Solder | 26 | Phosphor Bronze | 0.079 in | 2 mm | Board to Board Cable | 10.8 mm | 0.425 in | Through Hole | 0.079 in | 2 mm | All | 4.5 A | Square | Elevated Socket | Forked | 2 | ||||
Samtec Inc. | -55 °C | 125 °C | Liquid Crystal Polymer (LCP) | Tin | 0.25 in | 6.35 mm | 0.076 µm | 3 µin | Gold | Black | Push-Pull | UL94 V-0 | Solder | 26 | Phosphor Bronze | 0.079 in | 2 mm | Board to Board Cable | 15.24 mm | 0.6 in | Through Hole | 0.079 in | 2 mm | All | 4.5 A | Square | Elevated Socket | Forked | 2 | ||||
Samtec Inc. | -55 °C | 125 °C | Liquid Crystal Polymer (LCP) | Tin | 0.54 in | 13.72 mm | 0.076 µm | 3 µin | Gold | Black | Push-Pull | UL94 V-0 | Solder | 26 | Phosphor Bronze | 0.079 in | 2 mm | Board to Board Cable | 7.87 mm | 0.31 in | Through Hole | 0.079 in | 2 mm | All | 4.5 A | Square | Elevated Socket | Forked | 2 | ||||
Samtec Inc. | -55 °C | 125 °C | Liquid Crystal Polymer (LCP) | Tin | 0.442 in | 11.23 mm | 0.25 çm | 10 çin | Gold | Black | Push-Pull | UL94 V-0 | Solder | 26 | Phosphor Bronze | 0.079 in | 2 mm | Board to Board Cable | 10.36 mm | 0.408 in | Through Hole | 0.079 in | 2 mm | All | 4.5 A | Square | Elevated Socket | Forked | 2 |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
| Distributor | Package | Quantity | $ | |
|---|---|---|---|---|
| Digikey | Bulk | 1 | $ 7.45 | |
Description
General part information
ESQT-113 Series
26 Position Elevated Socket Connector 0.079" (2.00mm) Through Hole Gold
Documents
Technical documentation and resources
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