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Discrete Semiconductor Products

RGPZ10BM40FHTL

Active
Rohm Semiconductor

430V 20A, TO-252, IGNITION IGBT FOR AUTOMOTIVE

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Search across all available documentation for this part.

DocumentsJudgment Criteria of Thermal EvaluationImportance of Probe Calibration When Measuring Power: Deskew+33
Product thumbnail image
Discrete Semiconductor Products

RGPZ10BM40FHTL

Active
Rohm Semiconductor

430V 20A, TO-252, IGNITION IGBT FOR AUTOMOTIVE

Deep-Dive with AI

DocumentsJudgment Criteria of Thermal EvaluationImportance of Probe Calibration When Measuring Power: Deskew+33

Technical Specifications

Parameters and characteristics for this part

SpecificationRGPZ10BM40FHTL
Current - Collector (Ic) (Max)20 A
Gate Charge14 nC
GradeAutomotive
Mounting TypeSurface Mount
Operating Temperature [Max]175 °C
Operating Temperature [Min]-40 C
Package / CaseSC-63, DPAK (2 Leads + Tab), TO-252-3
Power - Max [Max]107 W
QualificationAEC-Q101
Supplier Device PackageTO-252
Td (on/off) @ 25°C4 µs, 500 ns
Test Condition100 Ohm, 300 V, 8 A, 5 V
Vce(on) (Max) @ Vge, Ic2 V
Voltage - Collector Emitter Breakdown (Max)460 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyCut Tape (CT) 1$ 2.12
10$ 1.76
100$ 1.40
500$ 1.18
1000$ 1.01
Digi-Reel® 1$ 2.12
10$ 1.76
100$ 1.40
500$ 1.18
1000$ 1.01
Tape & Reel (TR) 2500$ 0.96
5000$ 0.92
NewarkEach (Supplied on Cut Tape) 1$ 2.96
10$ 1.92
25$ 1.81
50$ 1.57
100$ 1.33
250$ 1.28
500$ 1.08
1000$ 1.00

Description

General part information

RGPZ10BM40FH Series

RGPZ10BM40FH is high reliability product which achieved both low Vce(sat)and high avalanche energy.

Documents

Technical documentation and resources

Judgment Criteria of Thermal Evaluation

Thermal Design

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

θ<sub>JA</sub> and Ψ<sub>JT</sub>

Thermal Design

4 Steps for Successful Thermal Designing of Power Devices

White Paper

Precautions for Thermal Resistance of Insulation Sheet

Thermal Design

Example of Heat Dissipation Design for TO Packages: Effect of Heat Dissipation Materials

Thermal Design

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

What Is Thermal Design

Thermal Design

Inner Structure

Package Information

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

Method for Monitoring Switching Waveform

Schematic Design & Verification

Reliability Test Result

Manufacturing Data

Moisture Sensitivity Level

Package Information

RGPZ10BM40FH Data Sheet

Data Sheet

About Flammability of Materials

Environmental Data

Anti-Whisker formation

Package Information

Condition of Soldering

Package Information

PCB Layout Thermal Design Guide

Thermal Design

Explanation for Marking

Package Information

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

How to Create Symbols for PSpice Models

Models

Taping Information

Package Information

About Export Administration Regulations (EAR)

Export Information

Power Eco Family: Overview of ROHM's Power Semiconductor Lineup

White Paper

How to Use LTspice&reg; Models: Tips for Improving Convergence

Schematic Design & Verification

How to Use the Thermal Resistance and Thermal Characteristics Parameters

Thermal Design

Two-Resistor Model for Thermal Simulation

Thermal Design

Generation Mechanism of Voltage Surge on Commutation Side (Basic)

Technical Article

Notes for Temperature Measurement Using Thermocouples

Thermal Design

Package Dimensions

Package Information

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

Types and Features of Transistors

Application Note

Compliance of the ELV directive

Environmental Data

Semikron Danfoss: Partnering for the Safe Supply of Industrial Power Modules

White Paper

AEC-Q101 Automotive Requirements

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