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BA17818FP-E2

Discrete Semiconductor Products

RGPZ10BM40FHTL

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Rohm Semiconductor

430V 20A, TO-252, IGNITION IGBT FOR AUTOMOTIVE

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Search across all available documentation for this part.

DocumentsAEC-Q101 Automotive Requirements IGBT Flammability +45

BA17818FP-E2

Discrete Semiconductor Products

RGPZ10BM40FHTL

Active

Rohm Semiconductor

430V 20A, TO-252, IGNITION IGBT FOR AUTOMOTIVE

Deep-Dive with AI

DocumentsAEC-Q101 Automotive Requirements IGBT Flammability +45

Specifications Series Pricing Description Documents

Technical Specifications

Parameters and characteristics for this part

Specification	RGPZ10BM40FHTL

Current - Collector (Ic) (Max) [Max]	20 A
Gate Charge	14 nC
Grade	Automotive
Mounting Type	Surface Mount
Operating Temperature [Max]	175 °C
Operating Temperature [Min]	-40 °C
Package / Case	TO-252-3, SC-63, DPAK (2 Leads + Tab)
Power - Max [Max]	107 W
Qualification	AEC-Q101
Supplier Device Package	TO-252
Td (on/off) @ 25°C	4 µs, 500 ns
Test Condition	8 A, 100 Ohm, 300 V, 5 V
Vce(on) (Max) @ Vge, Ic	2 V
Voltage - Collector Emitter Breakdown (Max) [Max]	460 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	Cut Tape (CT)	1	$ 2.12
		10	$ 1.76
		100	$ 1.40
		500	$ 1.18
		1000	$ 1.01
	Digi-Reel®	1	$ 2.12
		10	$ 1.76
		100	$ 1.40
		500	$ 1.18
		1000	$ 1.01
	N/A	7434	$ 2.93
	Tape & Reel (TR)	2500	$ 0.96
		5000	$ 0.92
Newark	Each (Supplied on Cut Tape)	1	$ 2.96
		10	$ 1.92
		25	$ 1.81
		50	$ 1.57
		100	$ 1.33
		250	$ 1.28
		500	$ 1.08
		1000	$ 1.00

Description

General part information

RGPZ10BM40FH Series

RGPZ10BM40FH is high reliability product which achieved both low Vce(sat)and high avalanche energy.

Documents

Technical documentation and resources

AEC-Q101 Automotive Requirements

Related Document

IGBT Flammability

Related Document

Two-Resistor Model for Thermal Simulation

Part Explanation

Application Note

What is a Thermal Model? (IGBT)

Example of Heat Dissipation Design for TO Packages: Effect of Heat Dissipation Materials

Measurement Method and Usage of Thermal Resistance RthJC

Calculation of Power Dissipation in Switching Circuit

Schematic Design & Verification

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Types and Features of Transistors

Application Note

Notes for Calculating Power Consumption:Static Operation

Condition of Soldering

Package Information

Basics of Thermal Resistance and Heat Dissipation

What Is Thermal Design

About Export Administration Regulations (EAR)

Export Information

Method for Monitoring Switching Waveform

Schematic Design & Verification

How to Use the Thermal Resistance and Thermal Characteristics Parameters

θ<sub>JA</sub> and Ψ<sub>JT</sub>

Explanation for Marking

Package Information

Reliability Test Result

Manufacturing Data

Notes for Temperature Measurement Using Thermocouples

Constitution Materials List

Environmental Data

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

Taping Information

Package Information

4 Steps for Successful Thermal Designing of Power Devices

Judgment Criteria of Thermal Evaluation

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

Precautions for Thermal Resistance of Insulation Sheet

Precautions When Measuring the Rear of the Package with a Thermocouple

Notes for Temperature Measurement Using Forward Voltage of PN Junction

Generation Mechanism of Voltage Surge on Commutation Side (Basic)

Technical Article

θ<sub>JC</sub> and Ψ<sub>JT</sub>

Package Dimensions

Package Information

How to Use LTspice® Models: Tips for Improving Convergence

Schematic Design & Verification

Moisture Sensitivity Level

Package Information

Anti-Whisker formation

Package Information

Power Eco Family: Overview of ROHM's Power Semiconductor Lineup

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

RGPZ10BM40FH Data Sheet

PCB Layout Thermal Design Guide

Semikron Danfoss: Partnering for the Safe Supply of Industrial Power Modules

Inner Structure

Package Information

Compliance of the ELV directive

Environmental Data

How to Create Symbols for PSpice Models

Estimation of switching losses in IGBTs operating with resistive load

Schematic Design & Verification

How to Use LTspice® Models

Schematic Design & Verification

Technical Data Sheet EN

RGPZ10BM40FH Series

Part	Qualification	Vce(on) (Max) @ Vge, Ic	Power - Max [Max]	Package / Case	Test Condition	Operating Temperature [Max]	Operating Temperature [Min]	Voltage - Collector Emitter Breakdown (Max) [Max]	Gate Charge	Mounting Type	Supplier Device Package	Grade	Td (on/off) @ 25°C	Current - Collector (Ic) (Max) [Max]
Rohm Semiconductor RGPZ10BM40FHTL	AEC-Q101	2 V	107 W	DPAK (2 Leads + Tab) SC-63 TO-252-3	5 V 8 A 100 Ohm 300 V	175 °C	-40 °C	460 V	14 nC	Surface Mount	TO-252	Automotive	4 µs 500 ns	20 A