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ROHM TDZVTR5.6
Discrete Semiconductor Products

TDZVTR11

Active
Rohm Semiconductor

ZENER DIODE, 11V, 0.5W, SOD-323HE ROHS COMPLIANT: YES

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Search across all available documentation for this part.

ROHM TDZVTR5.6
Discrete Semiconductor Products

TDZVTR11

Active
Rohm Semiconductor

ZENER DIODE, 11V, 0.5W, SOD-323HE ROHS COMPLIANT: YES

Deep-Dive with AI

Technical Specifications

Parameters and characteristics for this part

SpecificationTDZVTR11
Current - Reverse Leakage @ Vr10 µA
Mounting TypeSurface Mount
Operating Temperature150 °C
Package / Case2-SMD, Flat Leads
Power - Max [Max]500 mW
Tolerance10 %
Voltage - Zener (Nom) (Vz)11 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyN/A 0$ 0.52
NewarkEach (Supplied on Cut Tape) 1$ 0.50
10$ 0.48
25$ 0.47
50$ 0.42
100$ 0.34
250$ 0.28
500$ 0.23
1000$ 0.18

Description

General part information

TDZV11 Series

TDZV11 is small mold type zener diode for voltage regulation.

Documents

Technical documentation and resources

Technical Data Sheet EN

Datasheet

What Are TVS Diodes?

Technical Article

What is a Thermal Model? (Diode)

Thermal Design

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

How to Select Reverse Current Protection Diodes for LDO Regulators

Schematic Design & Verification

Selection Method and Usage of TVS Diodes

Technical Article

What Is Thermal Design

Thermal Design

How to Use the Thermal Resistance and Thermal Characteristics Parameters

Thermal Design

PCB Layout for TVS Diodes

Schematic Design & Verification

Inner Structure

Package Information

Diode Types and Applications

Technical Article

Differences between TVS and Zener Diodes

Technical Article

Constitution Materials List

Environmental Data

How to Create Symbols for PSpice Models

Models

Certificate of not containing SVHC under REACH Regulation

Environmental Data

Two-Resistor Model for Thermal Simulation

Thermal Design

Low-Side Current Sensing Circuit Design

Schematic Design & Verification

PCB Layout Thermal Design Guide

Thermal Design

Explanation for Marking

Package Information

Absolute Maximum Rating and Electrical Characteristics of Diodes

Technical Article

Notes for Calculating Power Consumption:Static Operation

Thermal Design

θ<sub>JC</sub> and Ψ<sub>JT</sub>

Thermal Design

Notes for Temperature Measurement Using Thermocouples

Thermal Design

About Export Regulations

Export Information

Taping Information

Package Information

Precautions When Measuring the Rear of the Package with a Thermocouple

Thermal Design

About Flammability of Materials

Environmental Data

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

Judgment Criteria of Thermal Evaluation

Thermal Design

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

Condition of Soldering / Land Pattern Reference

Package Information

Anti-Whisker formation - Diodes

Package Information

ESD Data

Characteristics Data

How to Use LTspice&reg; Models: Tips for Improving Convergence

Schematic Design & Verification

Power Loss and Thermal Design of Diodes

Thermal Design

Moisture Sensitivity Level - Diodes

Package Information

Compliance of the RoHS directive

Environmental Data

Basics of Thermal Resistance and Heat Dissipation

Thermal Design

Package Dimensions

Package Information

Notes for Temperature Measurement Using Forward Voltage of PN Junction

Thermal Design

θ<sub>JA</sub> and Ψ<sub>JT</sub>

Thermal Design

Part Explanation

Application Note

How to Use LTspice&reg; Models

Schematic Design & Verification

Reliability Test Result

Manufacturing Data

List of Diode Package Thermal Resistance

Thermal Design

Method for Monitoring Switching Waveform

Schematic Design & Verification