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UT6J3TCR
Discrete Semiconductor Products

UT6J3TCR

Active
Rohm Semiconductor

MOSFET 2P-CH 20V 3A HUML2020L8

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UT6J3TCR
Discrete Semiconductor Products

UT6J3TCR

Active
Rohm Semiconductor

MOSFET 2P-CH 20V 3A HUML2020L8

Deep-Dive with AI

Technical Specifications

Parameters and characteristics for this part

SpecificationUT6J3TCR
Configuration2 P-Channel (Dual)
Current - Continuous Drain (Id) @ 25°C3 A
Drain to Source Voltage (Vdss)20 V
Gate Charge (Qg) (Max) @ Vgs8.5 nC
Input Capacitance (Ciss) (Max) @ Vds2000 pF
Mounting TypeSurface Mount
Operating Temperature150 °C
Package / Case6-PowerUDFN
Power - Max [Max]2 W
Rds On (Max) @ Id, Vgs85 mOhm
Supplier Device PackageHUML2020L8
Vgs(th) (Max) @ Id1 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyN/A 1174$ 1.15
2825$ 1.15

Description

General part information

UT6J3 Series

The UT6J3 is a Small Surface Mount Package MOSFET for switching application.

Documents

Technical documentation and resources

UT6J3TCR | Datasheet

Datasheet

Inner Structure

Package Information

MOSFET Gate Resistor Setting for Motor Driving

Technical Article

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

What Is Thermal Design

Thermal Design

List of Transistor Package Thermal Resistance

Thermal Design

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

P-channel Power MOSFETs selection guide

Technical Article

Types and Features of Transistors

Application Note

Two-Resistor Model for Thermal Simulation

Thermal Design

Temperature derating method for Safe Operating Area (SOA)

Schematic Design & Verification

Method for Monitoring Switching Waveform

Schematic Design & Verification

Part Explanation

Application Note

Notes for Temperature Measurement Using Thermocouples

Thermal Design

UT6J3 ESD Data

Characteristics Data

Explanation for Marking

Package Information

Anti-Whisker formation - Transistors

Package Information

Taping Information

Package Information

What is a Thermal Model? (Transistor)

Thermal Design

How to Create Symbols for PSpice Models

Models

Notes for Calculating Power Consumption:Static Operation

Thermal Design

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

Package Dimensions

Package Information

Moisture Sensitivity Level - Transistors

Package Information

Basics of Thermal Resistance and Heat Dissipation

Thermal Design

Calculation of Power Dissipation in Switching Circuit

Schematic Design & Verification

Precautions When Measuring the Rear of the Package with a Thermocouple

Thermal Design

Compliance of the RoHS directive

Environmental Data

PCB Layout Thermal Design Guide

Thermal Design

Constitution Materials List

Environmental Data

About Export Regulations

Export Information

Certificate of not containing SVHC under REACH Regulation

Environmental Data

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

MOSFET Gate Drive Current Setting for Motor Driving

Technical Article

Condition of Soldering / Land Pattern Reference

Package Information

How to Use LTspice® Models

Schematic Design & Verification

How to Use LTspice® Models: Tips for Improving Convergence

Schematic Design & Verification

Notes for Temperature Measurement Using Forward Voltage of PN Junction

Thermal Design

About Flammability of Materials

Environmental Data