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TSM-1xx-02-x-DV-LC
Connectors, Interconnects

TSM-140-02-S-DV-LC

Active
Samtec Inc.

CONN UNSHROUDED HEADER HDR 80 POS 2.54MM SOLDER ST TOP ENTRY SMD TUBE

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DocumentsDatasheet
TSM-1xx-02-x-DV-LC
Connectors, Interconnects

TSM-140-02-S-DV-LC

Active
Samtec Inc.

CONN UNSHROUDED HEADER HDR 80 POS 2.54MM SOLDER ST TOP ENTRY SMD TUBE

Deep-Dive with AI

DocumentsDatasheet

Technical Specifications

Parameters and characteristics for this part

SpecificationTSM-140-02-S-DV-LC
Connector TypeCuttable, Header
Contact Finish - MatingGold
Contact Finish - PostTin
Contact Finish Thickness - Mating30 Áin
Contact Finish Thickness - Mating0.76 Ám
Contact Length - Mating8.13 mm
Contact Length - Mating0.32 in
Contact MaterialPhosphor Bronze
Contact ShapeSquare
Contact TypeMale Pin
Fastening TypePush-Pull
Insulation ColorBlack
Insulation Height0.1 in
Insulation Height2.54 mm
Insulation MaterialLiquid Crystal Polymer (LCP)
Material Flammability RatingUL94 V-0
Mounting TypeSurface Mount
Number of Positions80
Number of Positions LoadedAll
Number of Rows2
Operating Temperature [Max]125 °C
Operating Temperature [Min]-55 °C
Pitch - Mating0.1 in
Pitch - Mating2.54 mm
Row Spacing - Mating [x]2.54 mm
Row Spacing - Mating [x]0.1 in
ShroudingUnshrouded
StyleBoard to Board, Cable
TerminationSolder

TSM-140 Series

PartStyleFastening TypeContact Finish - PostInsulation MaterialMounting TypeOperating Temperature [Min]Operating Temperature [Max]Insulation HeightInsulation HeightContact TypeConnector TypeContact Length - MatingContact Length - MatingContact Finish - MatingRow Spacing - Mating [x]Row Spacing - Mating [x]Contact ShapeContact MaterialNumber of RowsInsulation ColorFeaturesTerminationContact Finish Thickness - MatingContact Finish Thickness - MatingNumber of Positions LoadedShroudingMaterial Flammability RatingPitch - MatingPitch - MatingNumber of PositionsContact Finish Thickness - PostContact Finish Thickness - PostContact Length - Mating [x]
TSM-1xx-03-x-DV-A
Samtec Inc.
TSM-140-03-L-DV-A
Board to Board
Cable
Push-Pull
Tin
Liquid Crystal Polymer (LCP)
Surface Mount
-55 °C
125 °C
0.1 in
2.54 mm
Male Pin
Cuttable
Header
0.42 in
10.67 mm
Gold
2.54 mm
0.1 in
Square
Phosphor Bronze
2
Black
Board Guide
Solder
10 çin
0.25 çm
All
Unshrouded
UL94 V-0
0.1 in
2.54 mm
80
TSM-1xx-03-G-DV-A
Samtec Inc.
TSM-140-03-G-DV-A
Board to Board
Cable
Push-Pull
Gold
Liquid Crystal Polymer (LCP)
Surface Mount
-55 °C
125 °C
0.1 in
2.54 mm
Male Pin
Cuttable
Header
0.42 in
10.67 mm
Gold
2.54 mm
0.1 in
Square
Phosphor Bronze
2
Black
Board Guide
Solder
10 çin
0.25 çm
All
Unshrouded
UL94 V-0
0.1 in
2.54 mm
80
3 µin
0.076 µm
Samtec Inc.
TSM-140-01-STL-DV
Board to Board
Cable
Push-Pull
Tin
Liquid Crystal Polymer (LCP)
Surface Mount
-55 °C
125 °C
0.1 in
2.54 mm
Male Pin
Cuttable
Header
5.84 mm
Gold
2.54 mm
0.1 in
Square
Phosphor Bronze
2
Black
Solder
30 Áin
0.76 Ám
All
Unshrouded
UL94 V-0
0.1 in
2.54 mm
80
0.23 in
Product Image
Samtec Inc.
TSM-140-04-STL-DV
Board to Board
Cable
Push-Pull
Tin
Liquid Crystal Polymer (LCP)
Surface Mount
-55 °C
125 °C
0.1 in
2.54 mm
Male Pin
Cuttable
Header
0.12 in
3.05 mm
Gold
2.54 mm
0.1 in
Square
Phosphor Bronze
2
Black
Solder
30 Áin
0.76 Ám
All
Unshrouded
UL94 V-0
0.1 in
2.54 mm
80
TSM-1xx-02-x-DV-A
Samtec Inc.
TSM-140-02-F-DV-A
Board to Board
Cable
Push-Pull
Tin
Liquid Crystal Polymer (LCP)
Surface Mount
-55 °C
125 °C
0.1 in
2.54 mm
Male Pin
Cuttable
Header
0.32 in
8.13 mm
Gold
2.54 mm
0.1 in
Square
Phosphor Bronze
2
Black
Board Guide
Solder
3 µin
0.076 µm
All
Unshrouded
UL94 V-0
0.1 in
2.54 mm
80
TSM-1xx-01-x-DV
Samtec Inc.
TSM-140-01-L-DV
Board to Board
Cable
Push-Pull
Tin
Liquid Crystal Polymer (LCP)
Surface Mount
-55 °C
125 °C
0.1 in
2.54 mm
Male Pin
Cuttable
Header
5.84 mm
Gold
2.54 mm
0.1 in
Square
Phosphor Bronze
2
Black
Solder
10 çin
0.25 çm
All
Unshrouded
UL94 V-0
0.1 in
2.54 mm
80
0.23 in
TSM-1xx-02-x-DV-LC
Samtec Inc.
TSM-140-02-S-DV-LC
Board to Board
Cable
Push-Pull
Tin
Liquid Crystal Polymer (LCP)
Surface Mount
-55 °C
125 °C
0.1 in
2.54 mm
Male Pin
Cuttable
Header
0.32 in
8.13 mm
Gold
2.54 mm
0.1 in
Square
Phosphor Bronze
2
Black
Solder
30 Áin
0.76 Ám
All
Unshrouded
UL94 V-0
0.1 in
2.54 mm
80
TSM-1xx-01-T-DV
Samtec Inc.
TSM-140-01-T-DV
Board to Board
Cable
Push-Pull
Tin
Liquid Crystal Polymer (LCP)
Surface Mount
-55 °C
105 ░C
0.1 in
2.54 mm
Male Pin
Cuttable
Header
5.84 mm
2.54 mm
0.1 in
Square
Phosphor Bronze
2
Black
Solder
All
Unshrouded
UL94 V-0
0.1 in
2.54 mm
80
0.23 in
Samtec Inc.
TSM-140-02-STL-DV
Board to Board
Cable
Push-Pull
Tin
Liquid Crystal Polymer (LCP)
Surface Mount
-55 °C
125 °C
0.1 in
2.54 mm
Male Pin
Cuttable
Header
0.32 in
8.13 mm
Gold
2.54 mm
0.1 in
Square
Phosphor Bronze
2
Black
Solder
30 Áin
0.76 Ám
All
Unshrouded
UL94 V-0
0.1 in
2.54 mm
80
Samtec Inc.
TSM-140-04-T-SV-P
Board to Board
Cable
Push-Pull
Tin
Liquid Crystal Polymer (LCP)
Surface Mount
-55 °C
105 ░C
0.1 in
2.54 mm
Male Pin
Cuttable
Header
0.12 in
3.05 mm
Square
Phosphor Bronze
1
Black
Pick and Place
Solder
All
Unshrouded
UL94 V-0
0.1 in
2.54 mm
40

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
ArrowN/A 1$ 13.00
10$ 12.31
25$ 11.84
50$ 11.55
100$ 9.93
DigikeyTube 5$ 13.00

Description

General part information

TSM-140 Series

Connector Header Surface Mount 80 position 0.100" (2.54mm)

Documents

Technical documentation and resources

Datasheet

Datasheet