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ROHM RB098BGE-30TL
Discrete Semiconductor Products

RFV5BGE6STL

Active
Rohm Semiconductor

DIODE SWITCHING SI 600V 5A 3-PIN(2+TAB) DPAK T/R

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Search across all available documentation for this part.

DocumentsTechnical Data Sheet ENNotes for Temperature Measurement Using Thermocouples+27
ROHM RB098BGE-30TL
Discrete Semiconductor Products

RFV5BGE6STL

Active
Rohm Semiconductor

DIODE SWITCHING SI 600V 5A 3-PIN(2+TAB) DPAK T/R

Deep-Dive with AI

DocumentsTechnical Data Sheet ENNotes for Temperature Measurement Using Thermocouples+27

Technical Specifications

Parameters and characteristics for this part

SpecificationRFV5BGE6STL
Current - Average Rectified (Io)5 A
Current - Reverse Leakage @ Vr10 µA
Mounting TypeSurface Mount
Operating Temperature - Junction150 ¯C
Package / CaseSC-63, DPAK (2 Leads + Tab), TO-252-3
Reverse Recovery Time (trr)40 ns
Speed200 mA, 500 ns
Supplier Device PackageTO-252GE
TechnologyStandard
Voltage - DC Reverse (Vr) (Max) [Max]600 V
Voltage - Forward (Vf) (Max) @ If2.8 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyCut Tape (CT) 1$ 2.09
10$ 1.33
100$ 0.90
500$ 0.72
1000$ 0.66
Digi-Reel® 1$ 2.09
10$ 1.33
100$ 0.90
500$ 0.72
1000$ 0.66
Tape & Reel (TR) 2500$ 0.55
NewarkEach (Supplied on Cut Tape) 1$ 1.53
10$ 1.12
25$ 1.03
50$ 0.93
100$ 0.83
250$ 0.76
500$ 0.68
1000$ 0.63

Description

General part information

RFV5BGE6S Series

RFV5BGE6S is Super Fast Recovery Diode for general rectification.

Documents

Technical documentation and resources

Technical Data Sheet EN

Datasheet

Notes for Temperature Measurement Using Thermocouples

Thermal Design

Method for Monitoring Switching Waveform

Schematic Design & Verification

What Is Thermal Design

Thermal Design

About Export Regulations

Export Information

Example of Heat Dissipation Design for TO Packages: Effect of Heat Dissipation Materials

Thermal Design

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

Diode Types and Applications

Technical Article

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

θ<sub>JA</sub> and Ψ<sub>JT</sub>

Thermal Design

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

How to Use the Thermal Resistance and Thermal Characteristics Parameters

Thermal Design

RFV5BGE6S ESD Data

Characteristics Data

List of Diode Package Thermal Resistance

Thermal Design

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

Power Loss and Thermal Design of Diodes

Thermal Design

How to Select Rectifier Diodes

Technical Article

Absolute Maximum Rating and Electrical Characteristics of Diodes

Technical Article

What is a Thermal Model? (Diode)

Thermal Design

PCB Layout Thermal Design Guide

Thermal Design

About Flammability of Materials

Environmental Data

Judgment Criteria of Thermal Evaluation

Thermal Design

Moisture Sensitivity Level - Diodes

Package Information

Two-Resistor Model for Thermal Simulation

Thermal Design

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

Reliability Test Result

Manufacturing Data

How to Select Reverse Current Protection Diodes for LDO Regulators

Schematic Design & Verification

Part Explanation

Application Note

How to Use LTspice&reg; Models: Tips for Improving Convergence

Schematic Design & Verification