Zenode.ai Logo
Beta
UMT6
Discrete Semiconductor Products

UMD25NTR

Active
Rohm Semiconductor

NPN+PNP, SOT-363, DUAL DIGITAL TRANSISTOR (BIAS RESISTOR BUILT-IN TRANSISTOR)

Deep-Dive with AI

Search across all available documentation for this part.

UMT6
Discrete Semiconductor Products

UMD25NTR

Active
Rohm Semiconductor

NPN+PNP, SOT-363, DUAL DIGITAL TRANSISTOR (BIAS RESISTOR BUILT-IN TRANSISTOR)

Technical Specifications

Parameters and characteristics for this part

SpecificationUMD25NTR
Current - Collector (Ic) (Max) [Max]100 mA
Current - Collector Cutoff (Max) [Max]500 nA
DC Current Gain (hFE) (Min) @ Ic, Vce [Min]80
Frequency - Transition250 MHz
Mounting TypeSurface Mount
Package / CaseSOT-363, SC-88, 6-TSSOP
Resistor - Base (R1)2.2 kOhm
Resistor - Emitter Base (R2)47 kOhms
Supplier Device PackageUMT6
Transistor Type1 NPN, 1 PNP - Pre-Biased (Dual)
Vce Saturation (Max) @ Ib, Ic300 mV
Voltage - Collector Emitter Breakdown (Max) [Max]50 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyCut Tape (CT) 1$ 0.43
10$ 0.26
100$ 0.16
500$ 0.12
1000$ 0.11
Digi-Reel® 1$ 0.43
10$ 0.26
100$ 0.16
500$ 0.12
1000$ 0.11
Tape & Reel (TR) 3000$ 0.09
6000$ 0.08
9000$ 0.08
15000$ 0.07
21000$ 0.07
30000$ 0.07
75000$ 0.06
150000$ 0.06

Description

General part information

UMD25N Series

UMD25N is a digital transistor contains a DTA123J chip and a DTC123J chip in a UMT package, therefore the mounting cost and area can be cut in half. It is suitable for inverter, interface, driver applications.

Documents

Technical documentation and resources

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

List of Transistor Package Thermal Resistance

Thermal Design

Moisture Sensitivity Level - Transistors

Package Information

Two-Resistor Model for Thermal Simulation

Thermal Design

Method for Monitoring Switching Waveform

Schematic Design & Verification

Notes for Temperature Measurement Using Forward Voltage of PN Junction

Thermal Design

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

Anti-Whisker formation - Transistors

Package Information

Basics of Thermal Resistance and Heat Dissipation

Thermal Design

Reliability Test Result

Manufacturing Data

Calculation of Power Dissipation in Switching Circuit

Schematic Design & Verification

How to Use LTspice® Models

Schematic Design & Verification

About Export Regulations

Export Information

Types and Features of Transistors

Application Note

Precautions When Measuring the Rear of the Package with a Thermocouple

Thermal Design

Package Dimensions

Package Information

Notes for Calculating Power Consumption:Static Operation

Thermal Design

How to Create Symbols for PSpice Models

Models

UMD25N Data Sheet

Data Sheet

What is a Thermal Model? (Transistor)

Thermal Design

Part Explanation

Application Note

What Is Thermal Design

Thermal Design

PCB Layout Thermal Design Guide

Thermal Design

Certificate of not containing SVHC under REACH Regulation

Environmental Data

Notes for Temperature Measurement Using Thermocouples

Thermal Design

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

Explanation for Marking

Package Information

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

Condition of Soldering / Land Pattern Reference

Package Information

Compliance of the RoHS directive

Environmental Data

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

About Flammability of Materials

Environmental Data

Temperature derating method for Safe Operating Area (SOA)

Schematic Design & Verification

Taping Information

Package Information

How to Use LTspice® Models: Tips for Improving Convergence

Schematic Design & Verification