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CSD95378BQ5MCT

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Texas Instruments

60A SYNCHRONOUS BUCK NEXFET™ SMART POWER STAGE WITH TAO OFFSET AND DUALCOOL™ PACKAGE

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VSON-CLIP (DMC)
Integrated Circuits (ICs)

CSD95378BQ5MCT

Active
Texas Instruments

60A SYNCHRONOUS BUCK NEXFET™ SMART POWER STAGE WITH TAO OFFSET AND DUALCOOL™ PACKAGE

Technical Specifications

Parameters and characteristics for this part

SpecificationCSD95378BQ5MCT
ApplicationsSynchronous Buck Converters
Current - Output / Channel60 A
Fault ProtectionOver Temperature, Short Circuit, Shoot-Through, Current Limiting, UVLO
FeaturesBootstrap Circuit, Status Flag
InterfacePWM
Load TypeInductive
Mounting TypeSurface Mount
Operating Temperature [Max]150 °C
Operating Temperature [Min]-55 °C
Package / Case12-PowerTFDFN
Supplier Device Package12-VSON (5x6)
TechnologyPower MOSFET
Voltage - Load [Max]16 V
Voltage - Load [Min]4.5 V
Voltage - Supply [Max]5.5 V
Voltage - Supply [Min]4.5 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyCut Tape (CT) 1$ 6.32
10$ 5.67
25$ 5.37
100$ 4.65
Digi-Reel® 1$ 6.32
10$ 5.67
25$ 5.37
100$ 4.65
Tape & Reel (TR) 250$ 2.96
500$ 2.95
Texas InstrumentsSMALL T&R 1$ 4.77
100$ 4.18
250$ 2.93
1000$ 2.36

Description

General part information

CSD95378BQ5MC Series

The CSD95378BQ5MC NexFET™ smart power stage is a highly-optimized design for use in a high-power, high-density synchronous buck converter. This product integrates the driver IC and power MOSFETs to complete the power stage switching function. This combination produces high-current, high-efficiency, and high-speed switching capability in a small 5-mm × 6-mm outline package. It also integrates the accurate current sensing and temperature sensing functionality to simplify system design and improve accuracy. In addition, the PCB footprint is optimized to help reduce design time and simplify the completion of the overall system design.

The CSD95378BQ5MC NexFET™ smart power stage is a highly-optimized design for use in a high-power, high-density synchronous buck converter. This product integrates the driver IC and power MOSFETs to complete the power stage switching function. This combination produces high-current, high-efficiency, and high-speed switching capability in a small 5-mm × 6-mm outline package. It also integrates the accurate current sensing and temperature sensing functionality to simplify system design and improve accuracy. In addition, the PCB footprint is optimized to help reduce design time and simplify the completion of the overall system design.