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Discrete Semiconductor Products

BAS16HYT116

Active
Rohm Semiconductor

DIODE: SWITCHING; SMD; 100V; 215MA; 4NS; SOT23; UFMAX: 1.25V; IFSM: 4A

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Product dimension image
Discrete Semiconductor Products

BAS16HYT116

Active
Rohm Semiconductor

DIODE: SWITCHING; SMD; 100V; 215MA; 4NS; SOT23; UFMAX: 1.25V; IFSM: 4A

Technical Specifications

Parameters and characteristics for this part

SpecificationBAS16HYT116
Capacitance @ Vr, F2 pF
Current - Average Rectified (Io)215 mA
Current - Reverse Leakage @ Vr500 nA
Mounting TypeSurface Mount
Operating Temperature - Junction150 ¯C
Package / CaseSOT-23-3, TO-236-3, SC-59
Reverse Recovery Time (trr)4 ns
Speed500 ns, 200 mA
Supplier Device PackageSOT-23
TechnologyStandard
Voltage - DC Reverse (Vr) (Max) [Max]80 V
Voltage - Forward (Vf) (Max) @ If1.25 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyN/A 884$ 0.32
NewarkEach (Supplied on Cut Tape) 1$ 0.31
10$ 0.19
25$ 0.16
50$ 0.12
100$ 0.08
250$ 0.08
500$ 0.08
1000$ 0.07
TMEN/A 1$ 0.35
10$ 0.13
100$ 0.09
500$ 0.08

Description

General part information

BAS16HY Series

BAS16HY is high reliability and low IRdiodes for high speed switching.

Documents

Technical documentation and resources

Part Explanation

Application Note

PCB Layout Thermal Design Guide

Thermal Design

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

Absolute Maximum Rating and Electrical Characteristics of Diodes

Technical Article

Two-Resistor Model for Thermal Simulation

Thermal Design

List of Diode Package Thermal Resistance

Thermal Design

What Is Thermal Design

Thermal Design

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

Power Loss and Thermal Design of Diodes

Thermal Design

Notes for Calculating Power Consumption:Static Operation

Thermal Design

Notes for Temperature Measurement Using Forward Voltage of PN Junction

Thermal Design

What is a Thermal Model? (Diode)

Thermal Design

Precautions When Measuring the Rear of the Package with a Thermocouple

Thermal Design

Anti-Whisker formation - Diodes

Package Information

About Export Regulations

Export Information

How to Use LTspice® Models: Tips for Improving Convergence

Schematic Design & Verification

Compliance of the RoHS directive

Environmental Data

Certificate of not containing SVHC under REACH Regulation

Environmental Data

How to Select Reverse Current Protection Diodes for LDO Regulators

Schematic Design & Verification

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

Method for Monitoring Switching Waveform

Schematic Design & Verification

Diode Types and Applications

Technical Article

Basics of Thermal Resistance and Heat Dissipation

Thermal Design

How to Use LTspice® Models

Schematic Design & Verification

Taping Information

Package Information

Package Dimensions

Package Information

BAS16HY Data Sheet

Data Sheet

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

About Flammability of Materials

Environmental Data

Moisture Sensitivity Level - Diodes

Package Information

Notes for Temperature Measurement Using Thermocouples

Thermal Design

Technical Data Sheet EN

Datasheet