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RH7E04BBJFRATCB
Discrete Semiconductor Products

RH7E04BBJFRATCB

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Rohm Semiconductor

PCH -30V -40A, DFN3333T8LSAB, POWER MOSFET FOR AUTOMOTIVE

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RH7E04BBJFRATCB
Discrete Semiconductor Products

RH7E04BBJFRATCB

Active
Rohm Semiconductor

PCH -30V -40A, DFN3333T8LSAB, POWER MOSFET FOR AUTOMOTIVE

Technical Specifications

Parameters and characteristics for this part

SpecificationRH7E04BBJFRATCB
Drain to Source Voltage (Vdss)30 V
Drive Voltage (Max Rds On, Min Rds On)10 V, 4.5 V
FET TypeP-Channel
Gate Charge (Qg) (Max) @ Vgs [Max]65 nC
GradeAutomotive
Input Capacitance (Ciss) (Max) @ Vds [Max]2990 pF
Mounting TypeSurface Mount
Operating Temperature175 °C
Package / Case8-PowerTDFN
Power Dissipation (Max)75 W
QualificationAEC-Q101
Rds On (Max) @ Id, Vgs7.5 mOhm
Supplier Device PackageDFN3333T8LSAB
TechnologyMOSFET (Metal Oxide)
Vgs (Max) [Max]5 V, -20 V
Vgs(th) (Max) @ Id2.5 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyN/A 0$ 2.21

Description

General part information

RH7E04BBJFRA Series

RH7E04BBJFRA is an automotive grade MOSFET that is AEC-Q101 qualified. Ideal for ADAS and Info. and Lighting and Body.

Documents

Technical documentation and resources

MOSFET Gate Resistor Setting for Motor Driving

Technical Article

Notes for Temperature Measurement Using Forward Voltage of PN Junction

Thermal Design

Thermal Resistance Data: DFN3333 T8LSAB

Thermal Design

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

What is a Thermal Model? (Transistor)

Thermal Design

Method for Monitoring Switching Waveform

Schematic Design & Verification

How to Use LTspice® Models

Schematic Design & Verification

RH7E04BBJFRA ESD Data

Characteristics Data

How to Use the Thermal Resistance and Thermal Characteristics Parameters

Thermal Design

θ<sub>JC</sub> and Ψ<sub>JT</sub>

Thermal Design

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

RH7E04BBJFRA Data Sheet

Data Sheet

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

Precautions When Measuring the Rear of the Package with a Thermocouple

Thermal Design

About Export Regulations

Export Information

Judgment Criteria of Thermal Evaluation

Thermal Design

Two-Resistor Model for Thermal Simulation

Thermal Design

Notes for Calculating Power Consumption:Static Operation

Thermal Design

PCB Layout Thermal Design Guide

Thermal Design

What Is Thermal Design

Thermal Design

How to Use LTspice&reg; Models: Tips for Improving Convergence

Schematic Design & Verification

Notes for Temperature Measurement Using Thermocouples

Thermal Design

Temperature derating method for Safe Operating Area (SOA)

Schematic Design & Verification

Moisture Sensitivity Level - Transistors

Package Information

MOSFET Gate Drive Current Setting for Motor Driving

Technical Article

θ<sub>JA</sub> and Ψ<sub>JT</sub>

Thermal Design

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

Calculation of Power Dissipation in Switching Circuit

Schematic Design & Verification

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

About Flammability of Materials

Environmental Data

Part Explanation

Application Note

Basics of Thermal Resistance and Heat Dissipation

Thermal Design

List of Transistor Package Thermal Resistance

Thermal Design

Compliance of the RoHS directive

Environmental Data

Anti-Whisker formation - Transistors

Package Information

Types and Features of Transistors

Application Note