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Deep-Dive with AI
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Deep-Dive with AI
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Technical Specifications
Parameters and characteristics for this part
| Specification | LM9704SL |
|---|---|
| Applications | Digital Imaging |
| Core Processor | CR16C |
| Interface | USART, Microwire/SPI, USB, ACCESS.bus |
| Mounting Type | Surface Mount |
| Number of I/O | 16 |
| Operating Temperature [Max] | 85 °C |
| Operating Temperature [Min] | -10 °C |
| Package / Case | CSP Dual Rows, Thermal Pads, 128-TFQFN |
| Program Memory Type | External Program Memory |
| Supplier Device Package | 128-TECSP (10x10) |
| Voltage - Supply [Max] | 2.75 V |
| Voltage - Supply [Min] | 2.25 V |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
| Distributor | Package | Quantity | $ | |
|---|---|---|---|---|
Description
General part information
LM9704 Series
IC DGTL IMAGEPROC 128LAMINATECSP
Documents
Technical documentation and resources