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BA17818FP-E2
Discrete Semiconductor Products

RFV5BM6STL

Obsolete
Rohm Semiconductor

DIODE GEN PURP 600V 5A TO252

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BA17818FP-E2
Discrete Semiconductor Products

RFV5BM6STL

Obsolete
Rohm Semiconductor

DIODE GEN PURP 600V 5A TO252

Technical Specifications

Parameters and characteristics for this part

SpecificationRFV5BM6STL
Current - Average Rectified (Io)5 A
Current - Reverse Leakage @ Vr10 µA
Mounting TypeSurface Mount
Operating Temperature - Junction150 ¯C
Package / CaseTO-252-3, SC-63, DPAK (2 Leads + Tab)
Reverse Recovery Time (trr)40 ns
Speed500 ns, 200 mA
Supplier Device PackageTO-252
TechnologyStandard
Voltage - DC Reverse (Vr) (Max) [Max]600 V
Voltage - Forward (Vf) (Max) @ If [Max]2.8 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyCut Tape (CT) 1$ 0.85
10$ 0.53
100$ 0.34
500$ 0.26
1000$ 0.23
Digi-Reel® 1$ 0.85
10$ 0.53
100$ 0.34
500$ 0.26
1000$ 0.23
N/A 1071$ 0.84
Tape & Reel (TR) 2500$ 0.42
5000$ 0.38
7500$ 0.37
12500$ 0.36

Description

General part information

RFV5BM6 Series

RFV5BM6S is Super Fast Recovery Diode for general rectification.

Documents

Technical documentation and resources

Notes for Temperature Measurement Using Thermocouples

Thermal Design

Two-Resistor Model for Thermal Simulation

Thermal Design

Notes for Calculating Power Consumption:Static Operation

Thermal Design

Moisture Sensitivity Level - Diodes

Package Information

Power Loss and Thermal Design of Diodes

Thermal Design

Report of SVHC under REACH Regulation

Environmental Data

PCB Layout Thermal Design Guide

Thermal Design

Absolute Maximum Rating and Electrical Characteristics of Diodes

Technical Article

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

θ<sub>JA</sub> and Ψ<sub>JT</sub>

Thermal Design

How to Use LTspice&reg; Models: Tips for Improving Convergence

Schematic Design & Verification

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

ESD Data

Characteristics Data

Compliance of the RoHS directive

Environmental Data

How to Use the Thermal Resistance and Thermal Characteristics Parameters

Thermal Design

Condition of Soldering / Land Pattern Reference

Package Information

Basics of Thermal Resistance and Heat Dissipation

Thermal Design

Judgment Criteria of Thermal Evaluation

Thermal Design

What is a Thermal Model? (Diode)

Thermal Design

Reliability Test Result

Manufacturing Data

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

Taping Information

Package Information

RFV5BM6S Data Sheet

Data Sheet

Example of Heat Dissipation Design for TO Packages: Effect of Heat Dissipation Materials

Thermal Design

Explanation for Marking

Package Information

About Export Regulations

Export Information

List of Diode Package Thermal Resistance

Thermal Design

What Is Thermal Design

Thermal Design

How to Use LTspice&reg; Models

Schematic Design & Verification

Package Dimensions

Package Information

Diode Types and Applications

Technical Article

θ<sub>JC</sub> and Ψ<sub>JT</sub>

Thermal Design

Part Explanation

Application Note

Method for Monitoring Switching Waveform

Schematic Design & Verification

How to Select Reverse Current Protection Diodes for LDO Regulators

Schematic Design & Verification

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

Anti-Whisker formation - Diodes

Package Information

Notes for Temperature Measurement Using Forward Voltage of PN Junction

Thermal Design

About Flammability of Materials

Environmental Data

Inner Structure

Package Information

Precautions When Measuring the Rear of the Package with a Thermocouple

Thermal Design

How to Select Rectifier Diodes

Technical Article

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design