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8-SOIC
Discrete Semiconductor Products

RRS090P03HZGTB

Active
Rohm Semiconductor

MOSFET, P-CH, 30V, 9A, SOP ROHS COMPLIANT: YES

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8-SOIC
Discrete Semiconductor Products

RRS090P03HZGTB

Active
Rohm Semiconductor

MOSFET, P-CH, 30V, 9A, SOP ROHS COMPLIANT: YES

Technical Specifications

Parameters and characteristics for this part

SpecificationRRS090P03HZGTB
Current - Continuous Drain (Id) @ 25°C9 A
Drain to Source Voltage (Vdss)30 V
Drive Voltage (Max Rds On, Min Rds On) [Max]4 V
Drive Voltage (Max Rds On, Min Rds On) [Min]10 V
FET TypeP-Channel
Gate Charge (Qg) (Max) @ Vgs30 nC
GradeAutomotive
Input Capacitance (Ciss) (Max) @ Vds [Max]3000 pF
Mounting TypeSurface Mount
Operating Temperature150 °C
Package / Case0.154 in
Package / Case8-SOIC
Package / Case3.9 mm
Power Dissipation (Max)2 W
QualificationAEC-Q101
Rds On (Max) @ Id, Vgs15.4 mOhm
Supplier Device Package8-SOP
TechnologyMOSFET (Metal Oxide)
Vgs (Max)20 V
Vgs(th) (Max) @ Id2.5 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyCut Tape (CT) 1$ 2.40
10$ 1.54
100$ 1.05
500$ 0.84
1000$ 0.77
Digi-Reel® 1$ 2.40
10$ 1.54
100$ 1.05
500$ 0.84
1000$ 0.77
N/A 1726$ 2.38
Tape & Reel (TR) 2500$ 0.67
NewarkEach (Supplied on Cut Tape) 1$ 2.34
10$ 1.53
25$ 1.37
50$ 1.21
100$ 1.05
250$ 0.95
500$ 0.85
1000$ 0.78

Description

General part information

RRS090P03HZG Series

RRS090P03HZG is a power mosfet for switching power supply.

Documents

Technical documentation and resources

Technical Data Sheet EN

Datasheet

Notes for Calculating Power Consumption:Static Operation

Thermal Design

What is a Thermal Model? (Transistor)

Thermal Design

List of Transistor Package Thermal Resistance

Thermal Design

Part Explanation

Application Note

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

θ<sub>JA</sub> and Ψ<sub>JT</sub>

Thermal Design

Two-Resistor Model for Thermal Simulation

Thermal Design

About Export Regulations

Export Information

Moisture Sensitivity Level - Transistors

Package Information

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

How to Use the Thermal Resistance and Thermal Characteristics Parameters

Thermal Design

θ<sub>JC</sub> and Ψ<sub>JT</sub>

Thermal Design

Package Dimensions

Package Information

Taping Information

Package Information

PCB Layout Thermal Design Guide

Thermal Design

What Is Thermal Design

Thermal Design

Explanation for Marking

Package Information

Types and Features of Transistors

Application Note

Certificate of not containing SVHC under REACH Regulation

Environmental Data

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

How to Use LTspice&reg; Models

Schematic Design & Verification

MOSFET Gate Resistor Setting for Motor Driving

Technical Article

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

RRS090P03HZG ESD Data

Characteristics Data

MOSFET Gate Drive Current Setting for Motor Driving

Technical Article

Basics of Thermal Resistance and Heat Dissipation

Thermal Design

Condition of Soldering / Land Pattern Reference

Package Information

Method for Monitoring Switching Waveform

Schematic Design & Verification

Calculation of Power Dissipation in Switching Circuit

Schematic Design & Verification

Temperature derating method for Safe Operating Area (SOA)

Schematic Design & Verification

Reliability Test Result

Manufacturing Data

RRS090P03HZG Data Sheet

Data Sheet

Notes for Temperature Measurement Using Forward Voltage of PN Junction

Thermal Design

About Flammability of Materials

Environmental Data

Anti-Whisker formation - Transistors

Package Information

Judgment Criteria of Thermal Evaluation

Thermal Design

How to Use LTspice&reg; Models: Tips for Improving Convergence

Schematic Design & Verification

Compliance of the RoHS directive

Environmental Data

Precautions When Measuring the Rear of the Package with a Thermocouple

Thermal Design

Notes for Temperature Measurement Using Thermocouples

Thermal Design