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CSD96415RWJT
Integrated Circuits (ICs)

CSD96415RWJT

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Texas Instruments

80-A PEAK CONTINUOUS CURRENT SYNCHRONOUS BUCK NEXFET™ POWER STAGE

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CSD96415RWJT
Integrated Circuits (ICs)

CSD96415RWJT

Active
Texas Instruments

80-A PEAK CONTINUOUS CURRENT SYNCHRONOUS BUCK NEXFET™ POWER STAGE

Technical Specifications

Parameters and characteristics for this part

SpecificationCSD96415RWJT
ApplicationsSynchronous Buck Converters
Current - Peak Output80 A
Fault ProtectionShoot-Through
FeaturesBootstrap Circuit
InterfacePWM
Load TypeInductive
Mounting TypeSurface Mount
Operating Temperature [Max]150 °C
Operating Temperature [Min]-55 °C
Package / Case41-PowerTFQFN
Supplier Device Package41-VQFN-CLIP
TechnologyPower MOSFET
Voltage - Load25 V
Voltage - Supply16 VDC

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyBulk 1$ 4.62
100$ 3.76
1000$ 3.13
Texas InstrumentsSMALL T&R 1$ 4.62
100$ 3.76
250$ 2.96
1000$ 2.51

Description

General part information

CSD96415 Series

The CSD96415RWJ NexFET™ power stage is a highly optimized design for use in a high-power, high-density synchronous buck converter. This product integrates the driver device and power MOSFETs to complete the power stage switching function. This combination produces high-current, high-efficiency, and high-speed switching capability in a small 5 mm × 6 mm package. It also integrates the accurate current sensing and temperature sensing functionality to simplify system design and improve accuracy. In addition, the PCB footprint has been optimized to help reduce design time and simplify the completion of the overall system design.

The CSD96415RWJ NexFET™ power stage is a highly optimized design for use in a high-power, high-density synchronous buck converter. This product integrates the driver device and power MOSFETs to complete the power stage switching function. This combination produces high-current, high-efficiency, and high-speed switching capability in a small 5 mm × 6 mm package. It also integrates the accurate current sensing and temperature sensing functionality to simplify system design and improve accuracy. In addition, the PCB footprint has been optimized to help reduce design time and simplify the completion of the overall system design.