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Discrete Semiconductor Products

RF302LAM2STR

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Rohm Semiconductor

DIODE GEN PURP 200V 3A PMDTM

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Product dimension image
Discrete Semiconductor Products

RF302LAM2STR

Active
Rohm Semiconductor

DIODE GEN PURP 200V 3A PMDTM

Technical Specifications

Parameters and characteristics for this part

SpecificationRF302LAM2STR
Current - Average Rectified (Io)3 A
Current - Reverse Leakage @ Vr10 ÁA
Mounting TypeSurface Mount
Operating Temperature - Junction150 ¯C
Package / CaseSOD-128
Reverse Recovery Time (trr)25 ns
Speed500 ns, 200 mA
Supplier Device PackagePMDTM
TechnologyStandard
Voltage - DC Reverse (Vr) (Max) [Max]200 V
Voltage - Forward (Vf) (Max) @ If [Max]920 mV

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyCut Tape (CT) 1$ 0.69
10$ 0.60
100$ 0.41
500$ 0.35
1000$ 0.29
Digi-Reel® 1$ 0.69
10$ 0.60
100$ 0.41
500$ 0.35
1000$ 0.29
N/A 2577$ 0.96
Tape & Reel (TR) 3000$ 0.26
6000$ 0.25
9000$ 0.23
30000$ 0.23

Description

General part information

RF302LAM2S Series

RF302LAM2S is low VFand low switching loss Fast Recovery Diode which is suitable for general rectification.

Documents

Technical documentation and resources

How to Select Reverse Current Protection Diodes for LDO Regulators

Schematic Design & Verification

θ<sub>JA</sub> and Ψ<sub>JT</sub>

Thermal Design

Notes for Calculating Power Consumption:Static Operation

Thermal Design

Anti-Whisker formation - Diodes

Package Information

How to Use LTspice&reg; Models: Tips for Improving Convergence

Schematic Design & Verification

Precautions When Measuring the Rear of the Package with a Thermocouple

Thermal Design

Compliance of the RoHS directive

Environmental Data

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

Taping Information

Package Information

Basics of Thermal Resistance and Heat Dissipation

Thermal Design

How to Select Rectifier Diodes

Technical Article

Report of SVHC under REACH Regulation

Environmental Data

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

Moisture Sensitivity Level - Diodes

Package Information

Judgment Criteria of Thermal Evaluation

Thermal Design

Notes for Temperature Measurement Using Thermocouples

Thermal Design

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

PCB Layout Thermal Design Guide

Thermal Design

Inner Structure

Package Information

How to Create Symbols for PSpice Models

Models

θ<sub>JC</sub> and Ψ<sub>JT</sub>

Thermal Design

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

Package Dimensions

Package Information

List of Diode Package Thermal Resistance

Thermal Design

Two-Resistor Model for Thermal Simulation

Thermal Design

How to Use LTspice&reg; Models

Schematic Design & Verification

RF302LAM2S ESD Data

Characteristics Data

About Flammability of Materials

Environmental Data

What is a Thermal Model? (Diode)

Thermal Design

How to Use the Thermal Resistance and Thermal Characteristics Parameters

Thermal Design

About Export Regulations

Export Information

RF302LAM2S Data Sheet

Data Sheet

Absolute Maximum Rating and Electrical Characteristics of Diodes

Technical Article

What Is Thermal Design

Thermal Design

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

Method for Monitoring Switching Waveform

Schematic Design & Verification

Reliability Test Result

Manufacturing Data

Condition of Soldering / Land Pattern Reference

Package Information

Notes for Temperature Measurement Using Forward Voltage of PN Junction

Thermal Design

Explanation for Marking

Package Information

Power Loss and Thermal Design of Diodes

Thermal Design

Diode Types and Applications

Technical Article

Part Explanation

Application Note