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EMD2
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RSB5.6SMT2N

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Rohm Semiconductor

ESD SUPPRESSOR ZENER BI-DIR 2.5V 2-PIN EMD T/R

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EMD2
Circuit Protection

RSB5.6SMT2N

Active
Rohm Semiconductor

ESD SUPPRESSOR ZENER BI-DIR 2.5V 2-PIN EMD T/R

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Technical Specifications

Parameters and characteristics for this part

SpecificationRSB5.6SMT2N
ApplicationsGeneral Purpose
Bidirectional Channels [custom]1
Mounting TypeSurface Mount
Operating Temperature [Max]150 °C
Operating Temperature [Min]-55 °C
Package / CaseSC-79, SOD-523
Power - Peak Pulse10 W
Power Line ProtectionFalse
Supplier Device PackageEMD2
TypeZener
Voltage - Breakdown (Min) [Min]4.76 V
Voltage - Reverse Standoff (Typ)2.5 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyN/A 0$ 0.29

Description

General part information

RSB5.6 Series

ROHM's zener diodes are available in various lineup as 2-pin mold surfacemount type and complex type.

Documents

Technical documentation and resources

EMD2 Part Marking

Related Document

Diode Flammability

Related Document

EMD2 TE61 Taping Spec

Datasheet

Datasheet

Datasheet

Two-Resistor Model for Thermal Simulation

Thermal Design

θ<sub>JA</sub> and Ψ<sub>JT</sub>

Thermal Design

Inner Structure

Package Information

θ<sub>JC</sub> and Ψ<sub>JT</sub>

Thermal Design

Moisture Sensitivity Level - Diodes

Package Information

Notes for Calculating Power Consumption:Static Operation

Thermal Design

Selection Method and Usage of TVS Diodes

Technical Article

Power Loss and Thermal Design of Diodes

Thermal Design

How to Use LTspice&reg; Models

Schematic Design & Verification

ESD Data

Characteristics Data

How to Use the Thermal Resistance and Thermal Characteristics Parameters

Thermal Design

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

Constitution Materials List

Environmental Data

Low-Side Current Sensing Circuit Design

Schematic Design & Verification

Judgment Criteria of Thermal Evaluation

Thermal Design

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

Reliability Test Result

Manufacturing Data

What Is Thermal Design

Thermal Design

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

How to Select Reverse Current Protection Diodes for LDO Regulators

Schematic Design & Verification

List of Diode Package Thermal Resistance

Thermal Design

PCB Layout Thermal Design Guide

Thermal Design

Precautions When Measuring the Rear of the Package with a Thermocouple

Thermal Design

Notes for Temperature Measurement Using Thermocouples

Thermal Design

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

Basics of Thermal Resistance and Heat Dissipation

Thermal Design

PCB Layout for TVS Diodes

Schematic Design & Verification

Part Explanation

Application Note

How to Use LTspice&reg; Models: Tips for Improving Convergence

Schematic Design & Verification

Anti-Whisker formation - Diodes

Package Information

Explanation for Marking

Package Information

Absolute Maximum Rating and Electrical Characteristics of Diodes

Technical Article

Notes for Temperature Measurement Using Forward Voltage of PN Junction

Thermal Design

About Export Regulations

Export Information

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

Condition of Soldering / Land Pattern Reference

Package Information

Method for Monitoring Switching Waveform

Schematic Design & Verification

Differences between TVS and Zener Diodes

Technical Article

Package Dimensions

Package Information

What Are TVS Diodes?

Technical Article

Compliance of the RoHS directive

Environmental Data

Certificate of not containing SVHC under REACH Regulation

Environmental Data

Diode Types and Applications

Technical Article

What is a Thermal Model? (Diode)

Thermal Design

Taping Information

Package Information

How to Create Symbols for PSpice Models

Models