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Integrated Circuits (ICs)

TPS54560BDDA

Active
Texas Instruments

CONV DC-DC 4.5V TO 60V SYNCHRONOUS STEP DOWN SINGLE-OUT 0.8V TO 58.8V 5A 8-PIN HSOIC EP TUBE

8-HSOP
Integrated Circuits (ICs)

TPS54560BDDA

Active
Texas Instruments

CONV DC-DC 4.5V TO 60V SYNCHRONOUS STEP DOWN SINGLE-OUT 0.8V TO 58.8V 5A 8-PIN HSOIC EP TUBE

Technical Specifications

Parameters and characteristics for this part

SpecificationTPS54560BDDA
Current - Output5 A
Frequency - Switching500 kHz
FunctionStep-Down
Mounting TypeSurface Mount
Number of Outputs1
Operating Temperature [Max]150 °C
Operating Temperature [Min]-40 °C
Output ConfigurationPositive
Output TypeAdjustable
Package / Case8-PowerSOIC (0.154", 3.90mm Width)
Supplier Device Package8-SO PowerPad
Synchronous RectifierFalse
TopologySplit Rail, Buck
Voltage - Input (Max) [Max]60 V
Voltage - Input (Min) [Min]4.5 V
Voltage - Output (Max) [Max]58.8 V
Voltage - Output (Min/Fixed)0.8 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
ArrowN/A 1$ 5.53
10$ 3.76
75$ 3.54
DigikeyN/A 517$ 6.64
Tube 1$ 6.53
10$ 5.87
75$ 5.54
150$ 4.81
300$ 4.56
525$ 4.09
1050$ 3.45
2550$ 3.28
Texas InstrumentsTUBE 1$ 4.49
100$ 3.66
250$ 2.88
1000$ 2.44

Description

General part information

TPS54560 Series

The TPS54560-Q1 is a 60-V, 5-A, step-down regulator with an integrated high side MOSFET. The device survives load dump pulses up to 65 V per ISO 7637. Current mode control provides simple external compensation and flexible component selection. A low-ripple, pulse-skip mode reduces the no load supply current to 146 µA. Shutdown supply current is reduced to 2 µA when the enable pin is pulled low.

Undervoltage lockout is internally set at 4.3 V but can be increased using an external resistor divider at the enable pin. The output voltage start-up ramp is internally controlled to provide a controlled start-up and eliminate overshoot.

A wide adjustable frequency range allows either efficiency or external component size to be optimized. Output current is limited cycle-by-cycle. Frequency foldback and thermal shutdown protects internal and external components during an overload condition.