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Discrete Semiconductor Products

R6524KNX3C16

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Rohm Semiconductor

650V 24A, TO-220AB, HIGH-SPEED SWITCHING POWER MOSFET

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Product thumbnail image
Discrete Semiconductor Products

R6524KNX3C16

Active
Rohm Semiconductor

650V 24A, TO-220AB, HIGH-SPEED SWITCHING POWER MOSFET

Technical Specifications

Parameters and characteristics for this part

SpecificationR6524KNX3C16
Current - Continuous Drain (Id) @ 25°C24 A
Drain to Source Voltage (Vdss)650 V
Drive Voltage (Max Rds On, Min Rds On)10 V
FET TypeN-Channel
Gate Charge (Qg) (Max) @ Vgs45 nC
Input Capacitance (Ciss) (Max) @ Vds [Max]1850 pF
Mounting TypeThrough Hole
Operating Temperature150 °C
Package / CaseTO-220-3
Power Dissipation (Max)253 W
Rds On (Max) @ Id, Vgs [Max]185 mOhm
Supplier Device PackageTO-220AB
TechnologyMOSFET (Metal Oxide)
Vgs (Max)20 V
Vgs(th) (Max) @ Id5 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyCut Tape (CT) 1$ 5.47
10$ 3.64
100$ 2.61
500$ 2.17
N/A 0$ 5.43
Tape & Reel (TR) 1000$ 2.05
NewarkEach 1$ 5.64
10$ 3.76
25$ 3.41
50$ 3.06
100$ 2.70
250$ 2.70
500$ 2.69

Description

General part information

R6524 Series

The R6xxxKNx series are high-speed switching products, Super Junction MOSFETs, that place an emphasis on high efficiency. This series products achieve higher efficiency via high-speed switching. High-speed switching makes it possible to contribute to higher efficiency in PFC and LLC circuits.

Documents

Technical documentation and resources

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

Notes for Temperature Measurement Using Forward Voltage of PN Junction

Thermal Design

TO-220AB Packing Information

Package Information

What Is Thermal Design

Thermal Design

Power Eco Family: Overview of ROHM's Power Semiconductor Lineup

White Paper

Notes for Temperature Measurement Using Thermocouples

Thermal Design

Calculation of Power Dissipation in Switching Circuit

Schematic Design & Verification

How to Use LTspice® Models

Schematic Design & Verification

TO-220AB Inner Structure

Package Information

Method for Monitoring Switching Waveform

Schematic Design & Verification

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

R6524KNX3 Data Sheet

Data Sheet

About Export Regulations

Export Information

θ<sub>JA</sub> and Ψ<sub>JT</sub>

Thermal Design

Anti-Whisker formation - Transistors

Package Information

Basics of Thermal Resistance and Heat Dissipation

Thermal Design

How to Use LTspice&reg; Models: Tips for Improving Convergence

Schematic Design & Verification

R6524KNX3 ESD Data

Characteristics Data

PCB Layout Thermal Design Guide

Thermal Design

About Flammability of Materials

Environmental Data

Part Explanation

Application Note

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

Judgment Criteria of Thermal Evaluation

Thermal Design

Notes for Calculating Power Consumption:Static Operation

Thermal Design

MOSFET Gate Drive Current Setting for Motor Driving

Technical Article

Report of SVHC under REACH Regulation

Environmental Data

Two-Resistor Model for Thermal Simulation

Thermal Design

Condition of Soldering / Land Pattern Reference

Package Information

Precautions When Measuring the Rear of the Package with a Thermocouple

Thermal Design

Temperature derating method for Safe Operating Area (SOA)

Schematic Design & Verification

Compliance of the RoHS directive

Environmental Data

TO-220AB Reliability Test Result

Manufacturing Data

TO-220AB Explanation for Marking

Package Information

Types and Features of Transistors

Application Note

θ<sub>JC</sub> and Ψ<sub>JT</sub>

Thermal Design

TO-220AB Dimension

Package Information

What is a Thermal Model? (Transistor)

Thermal Design

List of Transistor Package Thermal Resistance

Thermal Design

Moisture Sensitivity Level - Transistors

Package Information

MOSFET Gate Resistor Setting for Motor Driving

Technical Article

How to Use the Thermal Resistance and Thermal Characteristics Parameters

Thermal Design

Example of Heat Dissipation Design for TO Packages: Effect of Heat Dissipation Materials

Thermal Design

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article