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Discrete Semiconductor Products

R6038YNZ4C13

Active
Rohm Semiconductor

MOSFET, N-CHANNEL, 600V, 38A, TO-247 ROHS COMPLIANT: YES

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Product dimension image
Discrete Semiconductor Products

R6038YNZ4C13

Active
Rohm Semiconductor

MOSFET, N-CHANNEL, 600V, 38A, TO-247 ROHS COMPLIANT: YES

Technical Specifications

Parameters and characteristics for this part

SpecificationR6038YNZ4C13
Current - Continuous Drain (Id) @ 25°C38 A
Drain to Source Voltage (Vdss)600 V
Drive Voltage (Max Rds On, Min Rds On)12 V, 10 V
FET TypeN-Channel
Gate Charge (Qg) (Max) @ Vgs [Max]50 nC
Input Capacitance (Ciss) (Max) @ Vds2350 pF
Mounting TypeThrough Hole
Operating Temperature150 °C
Package / CaseTO-247-3
Power Dissipation (Max)348 W
Rds On (Max) @ Id, Vgs96 mOhm
Supplier Device PackageTO-247
TechnologyMOSFET (Metal Oxide)
Vgs (Max)30 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyTube 1$ 8.12
10$ 5.57
25$ 4.91
120$ 4.10
360$ 3.70
600$ 3.55
1080$ 3.40
2520$ 3.28
NewarkEach 1$ 6.69
10$ 5.50
25$ 5.38
50$ 5.24
100$ 5.12
250$ 4.98

Description

General part information

R6038YNZ4 Series

R6038YNZ4 is a power MOSFET with low on-resistance and fast switching, suitable for the switching application.

Documents

Technical documentation and resources

Judgment Criteria of Thermal Evaluation

Thermal Design

Moisture Sensitivity Level - Transistors

Package Information

Explanation for Marking

Package Information

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

What is a Thermal Model? (Transistor)

Thermal Design

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

R6038YNZ4 Data Sheet

Data Sheet

Two-Resistor Model for Thermal Simulation

Thermal Design

Temperature derating method for Safe Operating Area (SOA)

Schematic Design & Verification

List of Transistor Package Thermal Resistance

Thermal Design

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

About Export Regulations

Export Information

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

Package Dimensions

Package Information

MOSFET Gate Drive Current Setting for Motor Driving

Technical Article

PCB Layout Thermal Design Guide

Thermal Design

Example of Heat Dissipation Design for TO Packages: Effect of Heat Dissipation Materials

Thermal Design

How to Use LTspice® Models: Tips for Improving Convergence

Schematic Design & Verification

Method for Monitoring Switching Waveform

Schematic Design & Verification

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

Power Eco Family: Overview of ROHM's Power Semiconductor Lineup

White Paper

θ<sub>JA</sub> and Ψ<sub>JT</sub>

Thermal Design

About Flammability of Materials

Environmental Data

Part Explanation

Application Note

What Is Thermal Design

Thermal Design

How to Use the Thermal Resistance and Thermal Characteristics Parameters

Thermal Design

Types and Features of Transistors

Application Note

Notes for Temperature Measurement Using Thermocouples

Thermal Design

Report of SVHC under REACH Regulation

Environmental Data