Zenode.ai Logo
Beta
RQ5E030AJTCL
Discrete Semiconductor Products

RQ5E030AJTCL

Active
Rohm Semiconductor

MOSFET, N-CH, 3A, 30V, SOT-346T

Deep-Dive with AI

Search across all available documentation for this part.

RQ5E030AJTCL
Discrete Semiconductor Products

RQ5E030AJTCL

Active
Rohm Semiconductor

MOSFET, N-CH, 3A, 30V, SOT-346T

Technical Specifications

Parameters and characteristics for this part

SpecificationRQ5E030AJTCL
Current - Continuous Drain (Id) @ 25°C3 A
Drain to Source Voltage (Vdss)30 V
Drive Voltage (Max Rds On, Min Rds On)4.5 V
FET TypeN-Channel
Gate Charge (Qg) (Max) @ Vgs [Max]2.1 nC
Input Capacitance (Ciss) (Max) @ Vds240 pF
Mounting TypeSurface Mount
Operating Temperature [Max]150 °C
Operating Temperature [Min]-55 °C
Package / CaseSC-96
Power Dissipation (Max) [Max]1 W
Rds On (Max) @ Id, Vgs75 mOhm
Supplier Device PackageTSMT3
TechnologyMOSFET (Metal Oxide)
Vgs (Max)12 V
Vgs(th) (Max) @ Id1.5 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyN/A 1885$ 0.72
NewarkEach (Supplied on Cut Tape) 1$ 0.65
10$ 0.41
25$ 0.37
50$ 0.32
100$ 0.28
250$ 0.24
500$ 0.21
1000$ 0.19

Description

General part information

RQ5E030AJ Series

RQ5E030AJ which is Small Surface Mount package is suitable for Switching.

Documents

Technical documentation and resources

Technical Data Sheet EN

Datasheet

Types and Features of Transistors

Application Note

RQ5E030AJ Data Sheet

Data Sheet

ESD Data

Characteristics Data

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

How to Create Symbols for PSpice Models

Models

Reliability Test Result

Manufacturing Data

Compliance of the RoHS directive

Environmental Data

About Export Regulations

Export Information

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

What Is Thermal Design

Thermal Design

Two-Resistor Model for Thermal Simulation

Thermal Design

Notes for Temperature Measurement Using Forward Voltage of PN Junction

Thermal Design

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

Package Dimensions

Package Information

Taping Information

Package Information

PCB Layout Thermal Design Guide

Thermal Design

Condition of Soldering / Land Pattern Reference

Package Information

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

Part Explanation

Application Note

Anti-Whisker formation - Transistors

Package Information

List of Transistor Package Thermal Resistance

Thermal Design

Precautions When Measuring the Rear of the Package with a Thermocouple

Thermal Design

Certificate of not containing SVHC under REACH Regulation

Environmental Data

How to Use LTspice® Models: Tips for Improving Convergence

Schematic Design & Verification

Calculation of Power Dissipation in Switching Circuit

Schematic Design & Verification

Temperature derating method for Safe Operating Area (SOA)

Schematic Design & Verification

About Flammability of Materials

Environmental Data

What is a Thermal Model? (Transistor)

Thermal Design

Basics of Thermal Resistance and Heat Dissipation

Thermal Design

How to Use LTspice® Models

Schematic Design & Verification

Inner Structure

Package Information

MOSFET Gate Resistor Setting for Motor Driving

Technical Article

Explanation for Marking

Package Information

Notes for Calculating Power Consumption:Static Operation

Thermal Design

Moisture Sensitivity Level - Transistors

Package Information

Notes for Temperature Measurement Using Thermocouples

Thermal Design

Method for Monitoring Switching Waveform

Schematic Design & Verification

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

MOSFET Gate Drive Current Setting for Motor Driving

Technical Article