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SCT2450KEGC11
Discrete Semiconductor Products

RGSX5TS65DHRC11

Active
Rohm Semiconductor

INSULATED GATE BIPOLAR TRANSISTOR, 114A I(C), 650V V(BR)CES, N-CHANNEL, TO-247, TO-247N, 3 PIN

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SCT2450KEGC11
Discrete Semiconductor Products

RGSX5TS65DHRC11

Active
Rohm Semiconductor

INSULATED GATE BIPOLAR TRANSISTOR, 114A I(C), 650V V(BR)CES, N-CHANNEL, TO-247, TO-247N, 3 PIN

Technical Specifications

Parameters and characteristics for this part

SpecificationRGSX5TS65DHRC11
Current - Collector (Ic) (Max) [Max]114 A
Current - Collector Pulsed (Icm)225 A
Gate Charge79 nC
IGBT TypeTrench Field Stop
Mounting TypeThrough Hole
Operating Temperature [Max]175 °C
Operating Temperature [Min]-40 C
Package / CaseTO-247-3
Power - Max [Max]404 W
Reverse Recovery Time (trr)114 ns
Supplier Device PackageTO-247N
Switching Energy1.9 mJ, 3.32 mJ
Td (on/off) @ 25°C43 ns, 113 ns
Test Condition75 A, 15 V, 10 Ohm, 400 V
Vce(on) (Max) @ Vge, Ic2.15 V
Voltage - Collector Emitter Breakdown (Max)650 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyTube 1$ 11.31
30$ 6.76
120$ 5.76
510$ 5.41
NewarkEach 1$ 11.28
10$ 11.25
25$ 6.91
50$ 6.45
100$ 5.98
250$ 5.97
900$ 5.62

Description

General part information

RGSX5TS65DHR Series

RGSX5TS65DHR is a 8μs SCSOA guaranteed IGBT, suitable for general inverter for automotive and industrial use. This product complies AEC-Q101 qualification.

Documents

Technical documentation and resources

Technical Data Sheet EN

Datasheet

Semikron Danfoss: Partnering for the Safe Supply of Industrial Power Modules

White Paper

What Is Thermal Design

Thermal Design

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

Generation Mechanism of Voltage Surge on Commutation Side (Basic)

Technical Article

Power Eco Family: Overview of ROHM's Power Semiconductor Lineup

White Paper

Method for Monitoring Switching Waveform

Schematic Design & Verification

Moisture Sensitivity Level

Package Information

Types and Features of Transistors

Application Note

About Export Administration Regulations (EAR)

Export Information

How to Use LTspice® Models: Tips for Improving Convergence

Schematic Design & Verification

How to Create Symbols for PSpice Models

Models

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

The Problem with Traditional Vaccine Storage Freezers and How ROHM Cutting-edge Power Solutions Can Take them to the Next Level

White Paper

Judgment Criteria of Thermal Evaluation

Thermal Design

Compliance of the ELV directive

Environmental Data

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

Example of Heat Dissipation Design for TO Packages: Effect of Heat Dissipation Materials

Thermal Design

4 Steps for Successful Thermal Designing of Power Devices

White Paper

PCB Layout Thermal Design Guide

Thermal Design

Precautions for Thermal Resistance of Insulation Sheet

Thermal Design

About Flammability of Materials

Environmental Data

Package Dimensions

Package Information

How to Use the Thermal Resistance and Thermal Characteristics Parameters

Thermal Design

Two-Resistor Model for Thermal Simulation

Thermal Design

Notes for Temperature Measurement Using Thermocouples

Thermal Design

Anti-Whisker formation

Package Information

θ<sub>JA</sub> and Ψ<sub>JT</sub>

Thermal Design

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design