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RENESAS 8T49N242-998NLGI
Integrated Circuits (ICs)

BM64300MUV-E2

Active
Rohm Semiconductor

3 HALL SENSORS THREE-PHASE BRUSHLESS MOTOR PRE-DRIVER

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Search across all available documentation for this part.

DocumentsTechnical Data Sheet ENVQFN040V6060 Package Information+22
RENESAS 8T49N242-998NLGI
Integrated Circuits (ICs)

BM64300MUV-E2

Active
Rohm Semiconductor

3 HALL SENSORS THREE-PHASE BRUSHLESS MOTOR PRE-DRIVER

Deep-Dive with AI

DocumentsTechnical Data Sheet ENVQFN040V6060 Package Information+22

Technical Specifications

Parameters and characteristics for this part

SpecificationBM64300MUV-E2
ApplicationsFan Controller
Current - Output100 mA
FunctionController - Speed
InterfacePWM
Motor Type - AC, DCBrushless DC (BLDC)
Motor Type - StepperMultiphase
Mounting TypeSurface Mount
Operating Temperature [Max]105 ░C
Operating Temperature [Min]-40 C
Output ConfigurationPre-Driver - Half Bridge (3)
Package / Case40-VFQFN Exposed Pad
Supplier Device PackageVQFN040V6060
TechnologyPower MOSFET
Voltage - Supply [Max]63 V
Voltage - Supply [Min]28 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyCut Tape (CT) 1$ 7.48
10$ 5.11
25$ 4.49
100$ 3.80
250$ 3.47
500$ 3.27
1000$ 3.10
Digi-Reel® 1$ 7.48
10$ 5.11
25$ 4.49
100$ 3.80
250$ 3.47
500$ 3.27
1000$ 3.10
N/A 1978$ 5.67
Tape & Reel (TR) 2000$ 2.96
NewarkEach (Supplied on Cut Tape) 1$ 3.69

Description

General part information

BM64300 Series

BM64300MUV is the pre-driver IC of sine wave drive for three-phase brushless motor driver that supports 48 V power supply controlling the motor driver constructed in external FETs. It detects a rotor position by 3 Hall sensors. In addition, silent and low vibration operations are implemented by making the output current a sine waveform.

Documents

Technical documentation and resources

Technical Data Sheet EN

Datasheet

VQFN040V6060 Package Information

Package Information

What Is Thermal Design

Thermal Design

PCB Layout Thermal Design Guide

Thermal Design

User's Guide for BM64300MUV-EVK-001 Evaluation Board

User's Guide

Factory Information

Manufacturing Data

Two-Resistor Model for Thermal Simulation

Thermal Design

How to Use the Thermal Resistance and Thermal Characteristics Parameters

Thermal Design

Heat Dissipation Effect of Thermal Via in Exposed Pad Type Package

Thermal Design

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

48V power supply, 3 hall sensor support, Three-phase brushless DC motor drive Reference Design

Reference Design

Judgment Criteria of Thermal Evaluation

Thermal Design

Solder Joint Rate and Thermal Resistance of Exposed Pad

Thermal Design

Precautions When Measuring the Rear of the Package with a Thermocouple

Thermal Design

θ<sub>JC</sub> and Ψ<sub>JT</sub>

Thermal Design

Design Guide and Example of Stencil for Exposed Pad

Thermal Design

θ<sub>JA</sub> and Ψ<sub>JT</sub>

Thermal Design

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

MOSFET Gate Drive Current Setting for Motor Driving

Technical Article

Basics of Thermal Resistance and Heat Dissipation

Thermal Design

Five Steps for Successful Thermal Design of IC

White Paper

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

MOSFET Gate Resistor Setting for Motor Driving

Technical Article

Thermal Resistance

Thermal Design